Heat transport apparatus and heat transport apparatus manufacturing method

• US 20060065385A1
• Filed: 12/04/2003
• Published: 03/30/2006
• Est. Priority Date: 12/12/2002
• Status: Active Grant

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Tonosaki, Minehiro, Yajima, Takashi, Kato, Eisaku, yajima, Masakazu
• Granted Patent: US 8,136,581 B2
• Time in Patent Office: Days
• US Class Current: 165/104.210
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/043 forming loops, e.g. capillary pumped loops
• CPC Class Codes: Y10T 29/49353 Heat pipe device making

Abstract

A heat transport device having a composite structure that is readily manufactured and a method for manufacturing such a heat transport device are provided. The heat transport device includes a first base plate having a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force; a second base plate having a face provided with a first concavity functioning as a vaporization chamber for vaporizing the working fluid, a second concavity functioning as a liquefaction chamber for liquefying the working fluid, a first ditch for transporting the vaporized working fluid, a second ditch for transporting the liquefied working fluid, the second base plate comprising a material having a thermal conductivity lower than that of silicon; and a thermoplastic or thermosetting resin material for bonding the first and second base plates. The heat transport device can be readily manufactured by heating the first and second base plates sandwiching a thermoplastic or thermosetting resin material therebetween.

Claims

1. A heat transport device comprising:

a first base plate including a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force;

a second base plate facing the first base plate, including a face provided with a first concavity functioning as a vaporization chamber for vaporizing the liquid-phase working fluid retained in the liquid suction and retention unit to a gas-phase working fluid, a second concavity functioning as a liquefaction chamber for liquefying the gas-phase working fluid vaporized at the vaporization chamber to the liquid-phase working fluid, a first ditch functioning as a channel for transporting the gas-phase working fluid from the vaporization chamber to the liquefaction chamber, and a second ditch functioning as a channel for transporting the liquid-phase working fluid from the liquefaction chamber to the liquid suction and retention unit, the second base plate comprising a material having a thermal conductivity lower than that of silicon; and

a thermoplastic or thermosetting resin material for bonding the first and second base plates.

2. The heat transport device according to claim 1, further comprising a third base plate facing the second base plate, so that the third base plate is disposed remote from the first base plate.

3. The heat transport device according to claim 2, wherein the first base plate and the third base plate envelop the second base plate, and the periphery of the first base plate and the periphery of the third base plate are sealed.

4. The heat transport device according to claim 1, further comprising a pair of laminating sheets disposed on the top face of the first base plate and on the bottom face of the second base plate so as to envelop the first and the second base plates.

5. The heat transport device according to claim 4, wherein the laminating sheets comprise a metal foil.

6. The heat transport device according to claim 2, wherein the second base plate comprises a resin material and the third base plate comprises a metal material.

7. The heat transport device according to claim 6, wherein the difference in coefficient of linear expansion between the second base plate and the third base plate is 5×

10<sup>−

6</sup> (1/°

C.) or less.

8. The heat transport device according to claim 1, further comprising a fourth base plate facing the third base plate, so that the fourth base plate is disposed remote from the first base plate.

9. A heat transport device comprising:

a vaporization unit including;

a first base plate having a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force;

a second base plate facing the first base plate, having a face provided with a concavity functioning as a vaporization chamber for vaporizing the liquid-phase working fluid retained in the liquid suction and retention unit to a gas-phase working fluid, and comprising a material having a thermal conductivity lower than that of silicon; and

a thermoplastic or thermosetting resin material for bonding the first and second base plates;

a liquefaction unit including;

a third base plate;

a fourth base plate facing the third base plate, having a face provided with a concavity functioning as a liquefaction chamber for liquefying the gas-phase working fluid to the liquid-phase working fluid, and comprising a material having a thermal conductivity lower than that of silicon; and

a thermoplastic or thermosetting resin material for bonding the third and fourth base plates;

a channel for transporting the gas-phase working fluid from the vaporization unit to the liquefaction unit; and

a channel for transporting the liquid-phase working fluid from the liquefaction unit to the vaporization unit.

10. A method for manufacturing a heat transport device, comprising:

a step of forming a first base plate including a liquid suction and retention unit for sucking and retaining a liquid-phase working fluid by capillary force;

a step of forming a second base having a face provided with a first concavity functioning as a vaporization chamber for vaporizing the liquid-phase working fluid retained in the liquid suction and retention unit to a gas-phase working fluid, a second concavity functioning as a liquefaction chamber for liquefying the gas-phase working fluid vaporized at the vaporization chamber to the liquid-phase working fluid, a first ditch functioning as a channel for transporting the gas-phase working fluid from the vaporization chamber to the liquefaction chamber, and a second ditch functioning as a channel for transporting the liquid-phase working fluid from the liquefaction chamber to the liquid suction and retention unit;

a step of laminating the first base plate, a thermoplastic or thermosetting resin material, and the second base plate; and

a step of bonding the first and the second base plates with the thermoplastic or thermosetting resin material by heating the composite of the first base plate, the thermoplastic or thermosetting resin material, and the second base plate under a pressurized condition.