System and method for forming solder joints

• US 20060065696A1
• Filed: 09/30/2004
• Published: 03/30/2006
• Est. Priority Date: 09/30/2004
• Status: Active Grant

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Agere Systems Incorporated (Broadcom, Inc.)
• Inventors: Kostiew, George
• Granted Patent: US 7,367,486 B2
• Time in Patent Office: Days
• US Class Current: 228/110.100
• CPC Class Codes: B23K 1/06 making use of vibrations, e.g. supersonic vibrations
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2203/0292 Using vibration, e.g. during soldering or screen printing
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3494 Heating methods for reflowing of solder using integral heating means H05K1/0212

Abstract

Disclosed herein are methods and devices for stimulating soldering of a substrate with a component during a reflow process. In an exemplified embodiment, the method involves placing a substrate/component combination into a reflow oven; directing the substrate/component combination to the heating zone of said reflow oven; and vibrating the substrate/component combination while said substrate/component combination is in said heating zone. The vibrating of the substrate/component combination occurs at a predetermined amplitude and frequency such that formation of a complete solder joint is stimulated without displacing said substrate and said component relative to each other.

Claims

1. A method of forming a solder joint between a substrate and a component comprising solder disposed therebetween, said method comprising;

placing a substrate/component combination into a reflow oven;

directing said substrate/component combination to a heating zone of said reflow oven; and

vibrating said substrate/component combination while said substrate/component combination is in said heating zone, wherein said vibrating occurs at a predetermined amplitude and frequency such that formation of a complete solder joint is encouraged without displacing said substrate and said component relative to each other.

2. The method of claim 1, wherein placing said substrate/component combination into a reflow oven comprises putting said substrate/component combination onto a carrier.

3. The method of claim 2, wherein said carrier is designed to engage a transfer conveyor comprised within said reflow oven.

4. The method of claim 3, wherein said carrier has engaged thereto a vibrating device that vibrates at a predetermined time in the reflow process, or at a predetermined temperature or predetermined position in the reflow oven, or a combination thereof.

5. The method of claim 1, wherein said substrate/component combination comprises interposing solder balls between said substrate and said component.

6. The method of claim 1, wherein said substrate is a printed circuit board.

7. The method of claim 1, wherein said component is a semiconductor device.

8. The method of claim 1, wherein said substrate/component combination is placed onto a transfer conveyor, said transfer conveyor having engaged thereto a vibrating device that vibrates at a predetermined time in the reflow process, or at a predetermined temperature or predetermined position in the reflow oven, or a combination thereof.

9. The method of claim 1, wherein said reflow oven comprises a platform designed for engaging said substrate/component combination, said platform comprising a vibrating device that vibrates at a predetermined time in the reflow process, or at a predetermined temperature or predetermined position in the reflow oven.

10. The method of claim 9, wherein said platform pneumatically engages said substrate/component combination.

11. A carrier designed for positioning onto a transfer conveyor of a reflow oven, said carrier comprising a vibrating device that vibrates at a predetermined time in a reflow process, or a predetermined temperature or predetermined position in the reflow oven.

12. A reflow oven for soldering electrical components to a substrate during a reflow process, said reflow oven comprising:

a tunnel;

a transfer conveyor for directing a substrate/component combination through said tunnel;

a heating zone for generating soldering temperatures at a certain location in said tunnel; and

a vibrating device interlinked to said transfer conveyor, wherein said vibrating device vibrates in said heating zone and vibrates at a predetermined amplitude and frequency such that formation of a complete solder joint is encouraged between said substrate and said component without displacing said substrate and said component relative to each other.

13. A carrier for holding a substrate/component combination during a reflow process, said carrier comprises a vibrating device engaged thereto that vibrates while said substrate/component combination is in said heating zone and vibrates at a predetermined amplitude and frequency such that formation of a complete solder joint is encouraged between said substrate and said component without displacing said substrate and said component relative to each other.

14. A reflow oven for soldering at least one component to a substrate during a reflow process, said reflow oven comprising:

a tunnel;

a transfer conveyor for directing a substrate/component combination through said tunnel;

at least one heating zone for generating soldering temperatures at a certain location in said tunnel; and

a platform designed for engaging said substrate/component combination during said reflow process, said platform comprising a vibrating device engaged thereto that vibrates while said substrate/component combination is in said heating zone and vibrates at a predetermined amplitude and frequency such that formation of a complete solder joint is stimulated between said substrate and said component without displacing said substrate and said component relative to each other.

15. The reflow oven of claim 14, wherein said platform travels in conjunction with said transfer conveyor.

16. The reflow oven of claim 14, wherein said substrate is a printed circuit board.

17. The reflow oven of claim 14, wherein said at least one component is a semiconductor device.

18. The reflow oven of claim 14, wherein said platform pneumatically engages said substrate/component combination.

19. The reflow oven of claim 14, wherein said substrate/component combination travels on said transfer conveyor via a carrier and said platform raises said substrate/component combination from said carrier.

20. In a reflow process for soldering together a substrate/component combination, the improvement comprising vibrating the substrate/component combination during the reflow process.