RFID DEVICE AND METHOD OF MANUFACTURE

• US 20060065738A1
• Filed: 09/30/2004
• Published: 03/30/2006
• Est. Priority Date: 09/30/2004
• Status: Abandoned Application

• Current Assignee: Ronald J. Dodge
• Original Assignee: Ronald J. Dodge
• Inventors: Ramsey, Robert E., Versic, Ronald James
• Application Number:
  US10/711,709
• Publication Number:
  US 20060065738A1
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 2224/83874 Ultraviolet [UV] curing
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Abstract

A method of making an RFID device which includes the steps of (a) applying a UV curable adhesive having electrically conductive particles therein to a pair of laterally displaced landing sites of antenna formed on a UV penetrable web in a manner such that the particles remain spatially positioned from one another, (b) bringing a pair die pads of a die into sufficient electrical contact with the landing sites to effect a Z axis conductivity through the particles between a respective die pad and landing site pad pair while precluding X-Y conductivity between the landing site pads, and (c) UV irradiating of the adhesive through and/or about the web in a manner to cure the adhesive join the die to the antenna. An RFID device is also provided by the process.

Claims

1. A method of making an RFID device which includes the steps of:

(a) applying a UV curable adhesive having electrically conductive particles therein to a pair of laterally displaced landing sites of an antenna formed on a UV penetrable web in a manner such that said particles remain spatially positioned from one another,

(b) bringing a pair die pads of a die into sufficient electrical contact with said landing sites to effect a Z axis conductivity through the particles between a respective die pad and landing site pad pair while precluding X-Y conductivity between the landing site pads, and

(c) UV irradiating of the adhesive in a manner to cure said adhesive joining said die to said antenna.

2. The method of claim 1, which further characterizes the step (a) wherein said particles are metallic coated spheres.

3. The method of claim 1, which further characterizes the step (c) to include introducing an inert gas into an area surrounding an exposed portion of said adhesive.

4. The method of claim 1, which further characterizes the step (c) to include irradiating through the web.

5. An RFID device made in accordance with the method of claim 1.

6. An RFID device, which includes:

a UV penetrable substrate;

an antenna adhered to said substrate having a landing site extending therefrom;

a die chip having a die pad extending therefrom which is disposed adjacent said antenna; and

a UV cured adhesive having electrically conductive particles dispersed therethrough in a manner to only provide electrical conductivity between said landing site and said die pad, and wherein said adhesive bonds said die chip and said antenna.