INTEGRATED LID FORMED ON MEMS DEVICE
First Claim
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1. An integrated circuit structure comprising:
- a cavity within a substrate;
an integrated lid over the cavity having an opening therethrough;
a first movable element disposed within the cavity, the first movable element having an opening therethrough and adapted for physical movement in at least one direction within the cavity; and
a pillar extending from a bottom of the cavity through the opening in the first movable element to an inner surface of the integrated lid;
wherein the opening through the lid is sealed using a second movable element within the cavity.
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Abstract
An integrated lid for micro-electro-mechanical system (MEMS) devices is formed from a nitride layer deposited over a cavity containing movable parts for the device. Pillars are formed through openings within large area movable parts to support the lid over those parts. Slides are formed and moved under large etchant openings through the lid to allow the openings to be sealed by sputtering.
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Citations
25 Claims
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1. An integrated circuit structure comprising:
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a cavity within a substrate;
an integrated lid over the cavity having an opening therethrough;
a first movable element disposed within the cavity, the first movable element having an opening therethrough and adapted for physical movement in at least one direction within the cavity; and
a pillar extending from a bottom of the cavity through the opening in the first movable element to an inner surface of the integrated lid;
wherein the opening through the lid is sealed using a second movable element within the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An integrated circuit structure comprising:
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a cavity within a substrate;
an integrated lid over the cavity, the lid having an opening therethrough;
a slide within the cavity disposed beneath the opening through the lid; and
a material formed between the slide and the lid, wherein the opening through the lid is sealed by the slide and the material formed between the slide and the lid. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of forming an integrated circuit structure, the method comprising:
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forming a cavity within a substrate;
forming a moving part within the cavity, the moving part having an opening therethrough and adapted for physical movement in at least one direction within the cavity;
forming an integrated lid over the cavity; and
forming a pillar extending from a bottom of the cavity through the opening in the moving part to an inner surface of the integrated lid;
wherein the pillar has a width greater than a widest portion of the moving part in a cross-section of the integrated circuit structure. - View Dependent Claims (21)
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20. (canceled)
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22. A method of forming an integrated circuit structure, the method comprising:
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forming a cavity within a substrate;
forming an integrated lid over the cavity, the lid having an opening therethrough;
forming a slide within the cavity disposed beneath the opening through the lid; and
forming a material between the slide and the lid, wherein the opening through the lid is sealed by the slide and the material formed between the slide and the lid. - View Dependent Claims (23, 24, 25)
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Specification