High performance probe system
First Claim
1. An apparatus for providing signal paths between an integrated circuit (IC) tester and a plurality of IC pads on a surface of an IC to be tested through which the IC can communicate with external circuits via signals, the apparatus comprising:
- a substantially flexible substrate;
a first signal path formed on the flexible substrate and conductively linked to a first point on the flexible substrate;
means for providing a conductive link between the first signal path and the IC tester;
a conductive first probe for contacting the first point on the flexible substrate and for contacting a first IC pad of the plurality of IC pads;
a rigid substrate;
a first structural member linking a second point on the flexible substrate proximate to the first point so as to substantially inhibit freedom of movement of the first point relative to the rigid substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC'"'"'s I/O pads. The probe board assembly includes one or more rigid substrate layers with traces and vias formed on or within the substrate layers providing relatively low bandwidth signal paths linking the tester to probes accessing some of the IC'"'"'s pads. The flex cable provides relatively high bandwidth signal paths linking the tester to probes accessing others of the IC'"'"'s pads.
42 Citations
71 Claims
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1. An apparatus for providing signal paths between an integrated circuit (IC) tester and a plurality of IC pads on a surface of an IC to be tested through which the IC can communicate with external circuits via signals, the apparatus comprising:
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a substantially flexible substrate;
a first signal path formed on the flexible substrate and conductively linked to a first point on the flexible substrate;
means for providing a conductive link between the first signal path and the IC tester;
a conductive first probe for contacting the first point on the flexible substrate and for contacting a first IC pad of the plurality of IC pads;
a rigid substrate;
a first structural member linking a second point on the flexible substrate proximate to the first point so as to substantially inhibit freedom of movement of the first point relative to the rigid substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. An apparatus for providing signal paths between an integrated circuit (IC) tester and a plurality of IC pads on a surface of an IC to be tested, the apparatus comprising:
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a rigid substrate;
a conductive first probe extending between the rigid substrate and a first IC pad of the plurality of IC pads;
a substantially flexible substrate having an end portion structurally linked to the rigid substrate so as to substantially inhibit freedom of movement of the end portion relative to the rigid substrate;
a first signal path formed on the flexible substrate;
means for providing a conductive link between the first signal path and the IC tester; and
means for conductively linking the first signal path to the first probe. - View Dependent Claims (27, 28, 29, 30, 31, 32)
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33. An apparatus for providing signal paths between first and second IC test equipment and a plurality of IC pads on a surface of an IC to be tested through which the IC can communicate with external circuits via signals, the apparatus comprising:
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a substantially rigid first substrate;
a substantially rigid third substrate;
a substantially flexible second substrate residing between and spaced apart from the first and third substrates;
a conductive first probe extending between the third substrate and a first IC pad of the plurality of IC pads;
a first signal path for conveying signals between the first probe and the second substrate through the third substrate;
a second signal path for conveying signals between the second substrate and the first test equipment through the first substrate; and
first means formed on the second substrate for conductively linking the first and second signal paths. - View Dependent Claims (34, 35, 36, 37, 38, 39, 40, 41, 42)
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43. An apparatus for providing signal paths from first and second IC test equipment to a plurality of IC pads on a surface of an IC to be tested, the apparatus comprising:
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a substantially rigid first substrate;
a substantially rigid third substrate;
a substantially flexible second substrate residing between, spaced apart from the first and third substrates and extending proximate to the second test equipment;
a conductive probe extending between the third substrate and a first IC pad of the plurality of IC pads;
a first signal path for conveying signals between the first probe and the second substrate through the third substrate;
a second signal path for conveying signals between the second substrate and the first test equipment through the first substrate; and
a third signal path extending through the second substrate and terminating on the second test equipment, signal routing means mounted on the second substrate for selectively coupling the second and third signal paths to the first signal path. - View Dependent Claims (44, 45, 46)
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47. An apparatus for providing signal paths between test equipment and a first integrated circuit (IC) pad and second IC pad on an IC to be tested, the apparatus comprising:
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a probe board assembly comprising at least one substrate layer and a first signal path through the probe board assembly;
a flexible substrate;
a second signal path formed on the flexible substrate;
first means for conductively linking the first signal path to the IC test equipment;
second means for conductively linking the second signal path to the IC test equipment;
third means for conductively linking the first signal path to the first IC pad; and
fourth means for conductively linking the second signal path to the second IC pad. - View Dependent Claims (48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69)
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70. An apparatus for providing signal paths between test equipment and a first integrated circuit (IC) pad and second IC pad on an IC to be tested, the apparatus comprising:
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a probe board assembly comprising at least one substrate layer and a first signal path through the probe board assembly;
a flexible substrate residing between the probe board assembly and the IC to be tested and having an aperture therein;
a second signal path formed in the flexible substrate;
means for conductively linking the second signal path to the test equipment;
a conductive first probe linking the probe board assembly to the first IC pad, the first probe passing through the aperture in the flexible substrate; and
a first conductive path extending from the second signal path to the probe board assembly and on the probe board assembly to the first probe. - View Dependent Claims (71)
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Specification