×

Calibration of thermal sensors for semiconductor dies

  • US 20060066384A1
  • Filed: 09/30/2004
  • Published: 03/30/2006
  • Est. Priority Date: 09/30/2004
  • Status: Active Grant
First Claim
Patent Images

1. An apparatus comprising:

  • a semiconductor die;

    a thermal sensor thermally coupled to the die to sense the temperature of the die and generate an output representing the sensed temperature; and

    an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×