Built-in antenna module for portable wireless terminal

• US 20060066490A1
• Filed: 09/15/2005
• Published: 03/30/2006
• Est. Priority Date: 09/17/2004
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Ku, Do-Il, Choe, Chin-Sop
• Granted Patent: US 7,397,432 B2
• Time in Patent Office: Days
• US Class Current: 343/702
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/245 with means for shaping the antenna pattern, e.g. in order to protect user against rf exposure
• CPC Class Codes: H01Q 5/371 Branching current paths
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence
• CPC Class Codes: H01Q 9/0442 with particular tuning means

Abstract

A built-in antenna module for a portable wireless terminal is provided. In the built-in antenna module, a mainboard, which is an RF board, has a feeding unit and a grounding unit. A radiator is disposed on one side of the mainboard and has a feed pin and a ground pin that are electrically connected to the feeding unit and the grounding unit, respectively. A conductive ground plate is disposed on the other side of the mainboard to have a predetermined height. An end of the conductive ground plate is grounded to the grounding unit of the mainboard. The distance between the radiator and the ground plate is maximized to improve antenna performance.

Claims

1. A built-in antenna module for a portable wireless terminal, the module comprising:

a mainboard being an RF board and having a feeding unit and a grounding unit;

a radiator disposed on one side of the mainboard, and having a feed pin and a ground pin electrically connected to the feeding unit and the grounding unit of the mainboard, respectively; and

a conductive ground plate disposed on the other side of the mainboard and spaced a predetermined height therefrom, an end of the conductive ground plate being grounded to the grounding unit of the mainboard,

wherein a distance between the radiator and the ground plate is maximized to improve antenna performance.

2. The module of claim 1, wherein the ground plate is used as a ground together with a conductive layer of the mainboard.

3. The module of claim 2, wherein the conductive layer is electrically connected with the end of the ground plate and is spaced a maximum distance from the radiator.

4. The module of claim 3, wherein the conductive layer is not formed on a portion of the mainboard covered with the ground plate.

5. The module of claim 4, wherein a plurality of nonconductive spacers are interposed between the mainboard and the ground plate so that a distance between the mainboard and the ground plate is not arbitrarily reduced.

6. The module of claim 1, wherein the ground plate is fixed to the mainboard by a solder.

7. The module of claim 1, wherein the ground plate is fixed to the mainboard by a plurality of screws.