Process control monitors for interferometric modulators
First Claim
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1. A method of monitoring deposition of material deposited during manufacturing of a micro-electro-mechanical system (MEMS), comprising:
- forming a process control monitor that consists of at least three layers of material deposited during the manufacturing, wherein the at least three layers of material is less than the number of layers deposited during manufacturing of the MEMS, wherein the at least three layers of material form an etalon; and
detecting light reflected from the etalon, whereby information regarding properties of the at least three layers is obtained.
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Abstract
Process control monitors are disclosed that are produced using at least some of the same process steps used to manufacture a MEMS device. Analysis of the process control monitors can provide information regarding properties of the MEMS device and components or sub-components in the device. This information can be used to identify errors in processing or to optimize the MEMS device. In some embodiments, analysis of the process control monitors may utilize optical measurements.
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Citations
32 Claims
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1. A method of monitoring deposition of material deposited during manufacturing of a micro-electro-mechanical system (MEMS), comprising:
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forming a process control monitor that consists of at least three layers of material deposited during the manufacturing, wherein the at least three layers of material is less than the number of layers deposited during manufacturing of the MEMS, wherein the at least three layers of material form an etalon; and
detecting light reflected from the etalon, whereby information regarding properties of the at least three layers is obtained. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A wafer, comprising:
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a plurality of interferometric modulators adapted for use in a display; and
a non-modulating interferometer. - View Dependent Claims (15, 16, 17)
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18. A method of monitoring deposition of material deposited during manufacturing of a micro-electro-mechanical system (MEMS), comprising:
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forming a process control monitor comprising one or more layers of material deposited during the manufacturing, wherein the number of layers of material in the process control monitor is less than the number of layers deposited during manufacturing of the MEMS; and
detecting the reflectance of the process control monitor, whereby the reflectance provides information regarding properties of the layers in the process control monitor. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26)
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27. A wafer, comprising:
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a plurality of interferometric modulators adapted for use in a display, the interferometric modulators comprising a plurality of material layers; and
a process control monitor comprising one or more of the material layers, wherein the process control monitor comprises less than all of the plurality of material layers. - View Dependent Claims (28, 29, 30)
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31. A method of manufacturing a combined micro-electro-mechanical system (MEMS) and process control monitor structure, comprising:
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forming a MEMS structure, wherein forming the MEMS structure includes one or more material deposition and patterning steps; and
simultaneously forming a process control monitor, wherein forming the process control monitor includes said one or more material deposition and patterning steps, wherein the process control monitor comprises less than all components present in the MEMS structure.
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32. A wafer produced by a process, comprising:
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depositing and patterning a series of material layers on a substrate to form a MEMS structure; and
simultaneously depositing and patterning a series of material layers on the substrate to form a process control monitor, wherein the process control monitor comprises less than all components present in the MEMS structure.
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Specification