Interferometric optical modulator using filler material and method

• US 20060066936A1
• Filed: 08/22/2005
• Published: 03/30/2006
• Est. Priority Date: 09/27/2004
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Chui, Clarence, Sampsell, Jeffrey B.
• Granted Patent: US 7,684,104 B2
• Time in Patent Office: Days
• US Class Current: 359/291
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 3/007 For controlling stiffness, e.g. ribs
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G09G 3/3466 based on interferometric effect

Abstract

Described is an apparatus, method for manufacturing, and systems comprising a MEMS device, for example, an interferometric modulator, comprising a substrate, a movable mirror, a deformable layer, and a support structure. In some embodiments, the support structure comprises a plurality of support posts. A connector secures the movable mirror secured to the deformable layer. At least one of the connector and the support post is a composite comprising a first component and a second component, where at the first component forms at least a portion of at least one of the perimeter of the connector and support post.

Claims

1. A microelectromechanical systems device comprising:

a substrate;

a deformable layer;

a support structure supporting the deformable layer;

a movable conductor positioned between the substrate and the deformable layer; and

a connector securing the movable conductor to the deformable layer;

wherein

at least one of the connector and the support structure comprises a first component and a second component,

at least a portion of the first component is disposed on the perimeter of at least one of the connector and the support structure; and

the first component comprises a non-electrically conductive filler material.

2. The microelectromechanical systems device of claim 1, wherein the support structure comprises a plurality of support posts, wherein the support posts are supported by the substrate and support the deformable layer.

3. The microelectromechanical systems device of claim 1, wherein the filler material comprises a self-planarizing material.

4. The microelectromechanical systems device of claim 1, wherein the filler material comprises a material selected from the group consisting of a dielectric material, a metal, and silicon.

5. The microelectromechanical systems device of claim 1, wherein the connector and deformable layer are integrated.

6. The microelectromechanical systems device of claim 1, wherein

the connector comprises a first component and a second component, and

the first component is annular, forming the sides of at least a portion of the connector.

7. The microelectromechanical systems device of claim 6, wherein the first component forms the sides of the entire connector.

8. The microelectromechanical systems device of claim 7, wherein the second component comprises a sacrificial material.

9. The microelectromechanical systems device of claim 8, wherein the sacrificial material comprises molybdenum, silicon, or a combination thereof.

10. The microelectromechanical systems device of claim 1, wherein at least one support post comprises a support post plug substantially formed from filler material.

11. The microelectromechanical systems device of claim 1, wherein the microelectromechanical systems device is an optical modulator.

12. The microelectromechanical systems device of claim 1, wherein:

the connector comprises a first component, and

the first component contacts the movable conductor and forms the sides of the lower portion of the connector.

13. The microelectromechanical systems device of claim 12, wherein the second component comprises a conductor.

14. The microelectromechanical systems device of claim 1, wherein the filler material is a spin-on material.

32. The microelectromechanical systems device of claim 1, further comprising:

a display;

a processor that is in electrical communication with said display, said processor being configured to process image data;

a memory device in electrical communication with said processor.

33. The microelectromechanical systems device of claim 32, further comprising:

a driver circuit configured to send at least one signal to said display.

34. The microelectromechanical systems device of claim 33, further comprising:

a controller configured to send at least a portion of said image data to said driver circuit.

35. The microelectromechanical systems device of claim 32, further comprising:

an image source module configured to send said image data to said processor.

36. The microelectromechanical systems device of claim 35, wherein said image source module comprises at least one of a receiver, transceiver, and transmitter.

15. A method for fabricating an optical modulator comprising:

forming over a substrate, a layer of a first sacrificial material, a mirror, and a layer of a second sacrificial material;

forming a first opening through the layer of the second sacrificial material thereby exposing the mirror; and

filling at least a portion of the sides of the opening with a filler material.

16. The method of claim 15, wherein the first opening is substantially centered over the mirror.

17. The method of claim 15, further comprising:

forming a second opening through the layer of the second sacrificial material and the first sacrificial material, adjacent to the mirror;

filling, at least partially, the second opening with a filler material; and

forming a deformable layer over the filler material.

18. The method of claim 16, wherein the second opening is substantially completely filled with the filler material.

19. The method of claim 15, wherein the filling comprises spin coating the filler material.

20. The method of claim 19, wherein the filler material comprises a photosensitive polymer.

21. The method of claim 20, wherein the filler material comprises a photoresist.

22. The method of claim 19, wherein the filler material comprises a spin-on glass or a spin-on dielectric.

23. The method of claim 22, wherein the filling comprises depositing the filler material to a thickness less than a height of the opening.

24. The method of claim 15, wherein the first opening is annular.

25. The method of claim 24, wherein the first opening is substantially filled with the filler material.

26. An interferometric modulator fabricated by the method of claim 15.

27. A microelectromechanical systems device comprising:

a deformable conductive layer;

a movable conductive layer;

an electrically conductive core extending between the deformable conductive layer and the movable conductive layer; and

a layer of a non-electrically conductive material surrounding the conductive core.

28. The microelectromechanical systems device of claim 27, wherein:

the microelectromechanical systems device is an optical modulator; and

the movable conductive layer is a mirror.

29. A microelectromechanical systems device comprising:

a substrate;

a layer of a first sacrificial material formed over the substrate;

a conductor formed over the layer of the first sacrificial material;

a layer of a second sacrificial material formed over the conductor;

a first opening through the layer of the second sacrificial material, wherein the first opening exposes the conductor; and

a means for filling discontinuities in first opening with a filler material.

30. The microelectromechanical systems device of claim 29, further comprising:

a deformable layer formed over the layer of the second sacrificial material; and

a plurality of posts extending between the substrate and the deformable layer.

31. A microelectromechanical systems device comprising:

a movable conductor;

a means for supporting the movable conductor;

a means for communicating electrical signals between the movable conductor and the means for supporting the movable conductor; and

a means for facilitating formation of the means for communicating electrical signals.

37. The microelectromechanical systems device of claim 31, further comprising:

an input device configured to receive input data and to communicate said input data to said processor.