Electric junction box

• US 20060067058A1
• Filed: 09/22/2005
• Published: 03/30/2006
• Est. Priority Date: 09/24/2004
• Status: Active Grant

• Current Assignee: Sumitomo Wiring Systems Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Wiring Systems Limited (Sumitomo Corporation)
• Inventors: Kita, Yukinori
• Granted Patent: US 7,333,337 B2
• Time in Patent Office: Days
• US Class Current: 361/710
• CPC Class Codes: B60R 16/0239 Electronic boxes
• CPC Class Codes: H05K 7/026 Multiple connections subassemblies
• CPC Class Codes: H05K 7/20854 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence

Abstract

A heat sink in an electric junction box has thermal diffusion portions having one of convex and concave shapes on the surface. The structure enlarges a surface area of the heat sink compared to a configuration in which a surface has no concavity or convexity, thereby allowing fast heat dissipation from the surface of the heat sink to the exterior of the junction box. Further, the heat sink has the thermal diffusion portions on the entire plate surface. The structure enlarges the surface area of the heat sink compared to a configuration in which the thermal diffusion portions are provided to only a portion of the surface, thereby further enhancing the heat dissipation.

Claims

1. An electric junction box comprising:

a circuit including a control circuit board and a bus bar, said control circuit board having conductive circuits formed in and electronic components mounted on a first one of front and rear surfaces thereof and said bus bar provided on a second one of the front and rear surfaces of said control circuit board;

a heat sink provided on said bus bar on a surface opposite to the surface facing said control circuit board through an insulating layer, said heat sink including a planar member including thermal diffusion portions having one of convex and concave shapes on a surface opposite to the surface contacting said bus bar; and

a case containing said circuit and said heat sink.

2. The electric junction box according to claim 1, wherein said thermal diffusion portions are provided on substantially the entire planar surface of said planar member of said heat sink.

3. The electric junction box according to claim 1, wherein said heat sink includes convex shaped thermal diffusion portions projecting from said surface opposite to the surface contacting said bus bar.

4. The electric junction box according to claim 3, further comprising:

a notch provided at a crest of each of said convex shaped thermal diffusion portions.

5. The electric junction box according to claim 1, wherein said heat sink includes concave shaped thermal diffusion portions provided on said surface opposite to the surface contacting said bus bar.

6. The electric junction box according to claim 1, wherein said thermal diffusion portions are positioned at substantially equal intervals along the length and width of said planar member of said heat sink.

7. The electric junction box according to claim 1, wherein said thermal diffusion portions are positioned at unequal intervals along the length and width of said planar member of said heat sink.

8. The electric junction box according to claim 1 wherein said thermal diffusion portions are formed having substantially uniform size and shape.

9. The electric junction box according to claim 1, wherein said thermal diffusion portions are formed having nonuniform size and shape.

10. The electric junction box according to claim 1, wherein said thermal diffusion portions are provided on less than the entire planar surface of said planar member of said heat sink.

11. The electric junction box according to claim 1, wherein said heat sink comprises a metal sheet.

12. A heat sink for a circuit including a control circuit board having conductive circuits formed in and electronic components mounted on a first one of front and rear surfaces thereof and a bus bar provided on a second one of the front and rear surfaces of said control circuit board, said heat sink provided on the bus bar on a surface opposite to the surface facing the control circuit board through an insulating layer, said heat sink comprising:

a planar member including thermal diffusion-portions having one of convex and concave shapes on a surface opposite to the surface contacting the bus bar.

13. The heat sink according to claim 12, wherein said thermal diffusion portions are provided on substantially the entire planar surface of said planar member of said heat sink.

14. The heat sink according to claim 12, wherein said heat sink includes convex shaped thermal diffusion portions projecting from said surface opposite to the surface contacting the bus bar, further comprising:

a notch provided at a crest of each of said convex shaped thermal diffusion portions.

15. The heat sink according to claim 12, wherein said heat sink includes concave shaped thermal diffusion portions provided on said surface opposite to the surface contacting the bus bar.

16. The heat sink according to claim 12, wherein said thermal diffusion portions are positioned at substantially equal intervals along the length and width of said planar member of said heat sink.

17. The heat sink according to claim 12, wherein said thermal diffusion portions are positioned at unequal intervals along the length and width of said planar member of said heat sink.

18. The heat sink according to claim 12, wherein said thermal diffusion portions are formed having substantially uniform size and shape.

19. The heat sink according to claim 12, wherein said thermal diffusion portions are provided on less than the entire planar surface of said planar member of said heat sink.

20. A heat sink for a circuit including a control circuit board having conductive circuits formed in and electronic components mounted on a first one of front and rear surfaces thereof and a bus bar provided on a second one of the front and rear surfaces of said control circuit board, said heat sink provided on the bus bar on a surface opposite to the surface facing the control circuit board through an insulating layer, said heat sink comprising:

a planar member including thermal diffusion portions having a substantially planar shape and projecting from a surface opposite to the surface contacting the bus bar.