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Semiconductor device and method of manufacture thereof

  • US 20060067059A1
  • Filed: 04/20/2005
  • Published: 03/30/2006
  • Est. Priority Date: 09/28/2004
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a power module in which a power semiconductor element is sealed with resin by the transfer molding method;

    a control substrate for controlling said power module; and

    a shielding plate provided on a front main surface of said power module, wherein said power module includes a structure for mounting said control substrate, said control substrate being mounted over said shielding plate via said structure.

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