Photoelectric composite interconnection assembly and electronics device using same

• US 20060067608A1
• Filed: 09/21/2005
• Published: 03/30/2006
• Est. Priority Date: 09/22/2004
• Status: Active Grant

• Current Assignee: Hitachi Cable Limited (Proterial Ltd.)
• Original Assignee: Hitachi Cable Limited (Proterial Ltd.)
• Inventors: Kobayashi, Masahiko, Hiruta, Akihiro
• Granted Patent: US 7,333,682 B2
• Time in Patent Office: Days
• US Class Current: 385/14
• CPC Class Codes: G02B 2006/12104 Mirror; Reflectors or the like
• CPC Class Codes: G02B 6/10 of the optical waveguide type G02B6/02, G02B6/24 take precedence; devices or arrangements for the control of light by electric, magnetic, electro-magnetic or acoustic means G02F1/00; transferring the modulation of modulated light G02F2/00; optical logic elements G02F3/00; optical analogue/digital converters G02F7/00
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/1221 made from organic materials
• CPC Class Codes: G02B 6/42 Coupling light guides with opto-electronic elements
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A photoelectric composite interconnection assembly having: a flexible substrate having an electric interconnection; and an electrical interface provided at both ends of the electric interconnection. A part of the electric interconnection is replaced by an optical transmission line.

Claims

1. A photoelectric composite interconnection assembly, comprising:

a flexible substrate comprising an electric interconnection; and

an electrical interface provided at both ends of the electric interconnection;

wherein a part of the electric interconnection is replaced by an optical transmission line.

2. The photoelectric composite interconnection assembly according to claim 1, wherein:

the electric interconnection is formed on the flexible substrate and replaced by the optical transmission line at an intermediate section thereof, and

the optical transmission line comprises a pair of optical element sections and a flexible optical waveguide that optically connects between the pair of optical element sections.

3. The photoelectric composite interconnection assembly according to claim 1, wherein:

the electrical interface comprises an electric connector and/or an electrode, and

the electrode is connectable with an external card edge connector.

4. The photoelectric composite interconnection assembly according to claim 2, wherein:

the pair of optical element sections comprises an electro-optic (E/O) conversion section and an opto-electric (O/E) conversion section,

the electro-optic (E/O) conversion section is electrically connected to the electrical interface provided at the one end of the electric interconnection,

the opto-electric (O/E) conversion section is electrically connected to the electrical interface provided at the other end of the electric interconnection, and

the optical waveguide is disposed between the electro-optic (E/O) conversion section and the opto-electric (O/E) conversion section to optically connect therebetween.

5. The photoelectric composite interconnection assembly according to claim 4, wherein:

the electro-optic (E/O) conversion section comprises a surface emitting laser.

6. The photoelectric composite interconnection assembly according to claim 5, wherein:

the surface emitting laser is flip-chip mounted on the flexible substrate.

7. The photoelectric composite interconnection assembly according to claim 2, wherein:

the pair of optical element sections comprises plural pairs of optical element sections formed on the flexible substrate, and

each of the plural pairs of optical element sections forms an optical transmission line with the corresponding flexible optical waveguide optically connecting between the pair of optical element sections.

8. The photoelectric composite interconnection assembly according to claim 4, further comprising:

a multiplexer for multiplexing plural electric signals provided between the electrical interface and the electro-optic (E/O) conversion section, and

a demultiplexer for demultiplexing multiplexed electric signals provided between the electrical interface and the opto-electric (O/E) conversion section.

9. The photoelectric composite interconnection assembly according to claim 4, further comprising:

a multiplexer for multiplexing plural electric signals externally connected to the electrical interface provided on the side of the electro-optic (E/O) conversion section, and

a demultiplexer for demultiplexing multiplexed electric signals externally connected to the electrical interface on the side of the opto-electric (O/E) conversion section.

10. The photoelectric composite interconnection assembly according to claim 1, further comprising:

a terminating resistance provided on the flexible substrate.

11. An electronics device, comprising:

the photoelectric composite interconnection assembly according to claim 1,

wherein the photoelectric composite interconnection assembly forms a transmission line between substrates or electronic modules that compose the electronics device.