Method of making a reflective display device using thin film transistor production techniques

• US 20060067650A1
• Filed: 08/19/2005
• Published: 03/30/2006
• Est. Priority Date: 09/27/2004
• Status: Abandoned Application

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Inventors: Chui, Clarence
• Application Number:
  US11/208,072
• Publication Number:
  US 20060067650A1
• Time in Patent Office: Days
• US Class Current: 385/147
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

MEMS devices (such as interferometric modulators) may be fabricated using thin film transistor (TFT) manufacturing techniques. In an embodiment, a MEMS manufacturing process includes identifying a TFT production line and arranging for the manufacture of MEMS devices on the TFT production line. In another embodiment, an interferometric modulator is at least partially fabricated on a production line previously configured for TFT production.

Claims

1. A MEMS manufacturing process, comprising:

identifying a thin film transistor production line at a first manufacturing plant; and

arranging for the first manufacturing plant to manufacture a partially fabricated interferometric modulator on the thin film transistor production line.

2. The MEMS manufacturing process of claim 1, further comprising arranging for the partially fabricated interferometric modulator to be moved to a second manufacturing plant.

3. The MEMS manufacturing process of claim 2, further comprising arranging for the second manufacturing plant to conduct at least one manufacturing step on the partially fabricated interferometric modulator.

4. The MEMS manufacturing process of claim 3, wherein the at least one manufacturing step comprises a release step.

5. The MEMS manufacturing process of claim 1, wherein the partially fabricated interferometric modulator is an unreleased interferometric modulator.

6. The MEMS manufacturing process of claim 1, wherein the thin film transistor production line is configured to produce a thin film transistor configured for a flat panel display.

7. The MEMS manufacturing process of claim 1, wherein the thin film transistor production line is configured to deposit a metal layer on a glass substrate.

8. The MEMS manufacturing process of claim 7, wherein the metal layer comprises chromium or molybdenum.

9. The MEMS manufacturing process of claim 7, wherein the thin film transistor production line is configured to deposit an insulating layer onto the metal layer.

10. The MEMS manufacturing process of claim 9, wherein the insulating layer comprises silicon nitride.

11. The MEMS manufacturing process of claim 9, wherein the thin film transistor production line is configured to deposit a silicon layer onto the insulating layer.

12. The MEMS manufacturing process of claim 11, wherein the silicon layer comprises amorphous silicon.

13. The MEMS manufacturing process of claim 11, wherein the thin film transistor production line is configured to deposit a second metal layer onto the silicon layer.

14. The MEMS manufacturing process of claim 13, wherein the second metal layer comprises aluminum.

15. The MEMS manufacturing process of claim 14, wherein the second metal layer comprises an aluminum alloy.

16. A partially fabricated interferometric modulator made by the MEMS manufacturing process of claim 1.

17. A method of making an interferometric modulator, comprising:

at least partially fabricating a thin film transistor on a production line;

reconfiguring the production line to form a reconfigured production line; and

at least partially fabricating an interferometric modulator on the reconfigured production line.

18. The method of claim 17, wherein at least partially fabricating an interferometric modulator on the reconfigured production line comprises fabricating an unreleased interferometric modulator.

19. The method of claim 17, wherein at least partially fabricating an interferometric modulator on the reconfigured production line comprises a release step.

20. The method of claim 18, further comprising shipping the unreleased interferometric modulator.

21. The method of claim 17, wherein the production line comprises the steps of:

depositing a first metal layer onto a non-semiconductor substrate;

depositing an insulating layer onto the metal layer;

depositing a semiconductor layer onto the insulating layer; and

depositing a second metal layer onto the semiconductor layer.

22. The method of claim 21, wherein the reconfigured production line also comprises the steps of:

depositing the first metal layer onto the non-semiconductor substrate;

depositing the insulating layer onto the metal layer;

depositing the semiconductor layer onto the insulating layer; and

depositing the second metal layer onto the semiconductor layer.

23. The method of claim 22, wherein reconfiguring the production line comprises changing a patterning step.

24. The method of claim 22, wherein reconfiguring the production line comprises changing a layer thickness.

25. A partially fabricated interferometric modulator made by the method of claim 17.

26. A method of making an interferometric modulator, comprising:

receiving a partially fabricated interferometric modulator at a second production line, the partially fabricated interferometric modulator having been made on a first production line configured for at least partially fabricating a non-interferometric device; and

subjecting the partially fabricated interferometric modulator to at least one manufacturing step on the second production line.

27. The method of claim 26, wherein the partially fabricated interferometric modulator is an unreleased interferometric modulator.

28. The method of claim 27, wherein the at least one manufacturing step comprises a release step.

29. The method of claim 26, wherein the non-interferometric device is a thin film transistor.

30. An interferometric modulator made by the method of claim 26.

31. A method for making an interferometric modulator, comprising fabricating a partially fabricated interferometric modulator on a reconfigured production line, the reconfigured production line having been previously configured for at least partially fabricating a thin film transistor.

32. The method of claim 31, further comprising shipping the partially fabricated interferometric modulator.

33. The method of claim 32, wherein the partially fabricated interferometric modulator is an unreleased interferometric modulator.

34. An unreleased interferometric modulator made by the method of claim 33.

35. A method of manufacturing a plurality of partially fabricated interferometric modulators, comprising:

depositing a first electrode onto a glass substrate, the first electrode being substantially free of indium tin oxide;

depositing an insulating layer onto the first electrode, depositing a sacrificial layer onto the insulating layer; and

depositing a second electrode onto the sacrificial layer;

the first electrode being patterned into rows and the second electrode being patterned into columns that overlap the rows, the rows and columns having an overlap area of at least about 50%.

36. An array of interferometric modulators made by the method of claim 35.

37. A display device, comprising:

an array of interferometric modulators as claimed in claim 36;

a processor that is in electrical communication with the array, the processor being configured to process image data; and

a memory device in electrical communication with the processor.

38. The display device of claim 37, further comprising:

a driver circuit configured to send at least one signal to the array.

39. The display device of claim 38, further comprising:

a controller configured to send at least a portion of the image data to the driver circuit.

40. The display device of claim 37, further comprising:

an image source module configured to send the image data to the processor.

41. The display device of claim 40, wherein the image source module comprises at least one of a receiver, transceiver, and transmitter.

42. The display device of claim 37, further comprising:

an input device configured to receive input data and to communicate the input data to the processor.