×

Semiconductor device manufacturing method

  • US 20060068572A1
  • Filed: 09/14/2005
  • Published: 03/30/2006
  • Est. Priority Date: 09/24/2004
  • Status: Active Grant
First Claim
Patent Images

1. A method of manufacturing a semiconductor device, comprising:

  • providing a semiconductor substrate comprising a first surface and a second surface;

    attaching a support body to the first surface;

    forming a hole in the semiconductor substrate from the second surface;

    forming an insulation film to cover at least part of the second surface, at least part of a sidewall of the hole and at least part of a bottom of the hole;

    forming a protection layer to cover at least a portion of the insulation film corresponding to a boundary between the covered sidewall of the hole and the covered bottom of the hole; and

    forming a wiring layer that is disposed on the second surface and extends into the hole.

View all claims
  • 6 Assignments
Timeline View
Assignment View
    ×
    ×