Multilayer structure forming method, method of manufacturing wiring board, and method manufacturing of electronic apparatus

• US 20060068573A1
• Filed: 09/12/2005
• Published: 03/30/2006
• Est. Priority Date: 09/27/2004
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Shintate, Tsuyoshi, Sakurada, Kazuaki, Yamada, Jun
• Granted Patent: US 7,767,252 B2
• Time in Patent Office: Days
• US Class Current: 438/584
• CPC Class Codes: H05K 2201/09581 Applying an insulating coating on the walls of holes
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 2203/013 Inkjet printing, e.g. for printing insulating material or resist
• CPC Class Codes: H05K 2203/1173 Differences in wettability, e.g. hydrophilic or hydrophobic areas
• CPC Class Codes: H05K 2203/1476 Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 3/125 by ink-jet printing
• CPC Class Codes: H05K 3/4664 Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence
• CPC Class Codes: H10K 71/13 using printing techniques, e.g. ink-jet printing or screen printing

Abstract

A droplet discharge apparatus is used in a multilayer structure forming method of the invention. The multilayer structure forming method includes: discharging droplets of a first conductive material to form a first conductive material pattern on a surface of an object; baking the first conductive material pattern to form a wiring pattern; discharging droplets of a first insulating material including a first photo-curable material to form a first insulating material pattern bordering via holes on the wiring pattern; curing the first insulating material pattern to form a first insulating pattern bordering the via holes; making the surface of the object lyophilic; discharging droplets of a second insulating material including a second photo-curable material to form a second insulating material pattern that covers the wiring pattern and the surface of the object which has been made lyophilic, and surrounds the first insulating pattern; and curing the second insulating material pattern to form a second insulating pattern that surrounds the first insulating pattern. In addition, preferably, the first conductive material includes silver (Ag) nanoparticles.

Claims

1. A multilayer structure forming method using a droplet discharge apparatus, comprising:

(A) discharging droplets of a first conductive material to form a first conductive material pattern on a surface of an object;

(B) baking the first conductive material pattern to form a wiring pattern;

(C) discharging droplets of a first insulating material including a first photo-curable material to form a first insulating material pattern bordering via holes on the wiring pattern;

(D) curing the first insulating material pattern to form a first insulating pattern bordering the via holes;

(E) making the surface of the object lyophilic;

(F) discharging droplets of a second insulating material including a second photo-curable material to form a second insulating material pattern that covers the wiring pattern and the surface of the object which has been made lyophilic, and surrounds the first insulating pattern; and

(G) curing the second insulating material pattern to form a second insulating pattern that surrounds the first insulating pattern.

2. The multilayer structure forming method according to claim 1,

wherein the first conductive material includes silver (Ag) nanoparticles.

3. The multilayer structure forming method according to claim 1, further comprising:

(H) discharging droplets of a second conductive material into the via holes to fill the via holes with the second conductive material; and

(I) sintering the second conductive material filled in the via holes to form conductive posts.

4. A method of manufacturing a wiring board, comprising the multilayer structure forming method according to claim 1.

5. A method of manufacturing an electronic apparatus, comprising the multilayer structure forming method according to claim 1.

6. A multilayer structure forming method using a droplet discharge apparatus, comprising:

(A) making a surface of a wiring pattern located on a surface of an object lyophobic;

(B) discharging droplets of a first insulating material including a first photo-curable material onto the surface of the wiring pattern, which has been made lyophobic, to form a first insulating material pattern bordering via holes on the wiring pattern;

(C) curing the first insulating material pattern to form a first insulating pattern bordering the via holes;

(D) making the surface of the object lyophilic;

(E) discharging droplets of a second insulating material including a second photo-curable material to form a second insulating material pattern that covers the wiring pattern and the surface of the object which has been made lyophilic, and surrounds the first insulating pattern; and

(F) curing the second insulating material pattern.

7. The multilayer structure forming method according to claim 6, further comprising:

(G) discharging droplets of a liquid conductive material to fill the via holes with the conductive material; and

(H) sintering the conductive material filled in the via holes to form conductive posts.

8. The multilayer structure forming method according to claim 7,

wherein the conductive material includes silver (Ag).

9. A method of manufacturing a wiring board, comprising the multilayer structure forming method according to claim 6.

10. A method of manufacturing an electronic apparatus, comprising the multilayer structure forming method according claim 6.