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Multilayer structure forming method, method of manufacturing wiring board, and method manufacturing of electronic apparatus

  • US 20060068573A1
  • Filed: 09/12/2005
  • Published: 03/30/2006
  • Est. Priority Date: 09/27/2004
  • Status: Active Grant
First Claim
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1. A multilayer structure forming method using a droplet discharge apparatus, comprising:

  • (A) discharging droplets of a first conductive material to form a first conductive material pattern on a surface of an object;

    (B) baking the first conductive material pattern to form a wiring pattern;

    (C) discharging droplets of a first insulating material including a first photo-curable material to form a first insulating material pattern bordering via holes on the wiring pattern;

    (D) curing the first insulating material pattern to form a first insulating pattern bordering the via holes;

    (E) making the surface of the object lyophilic;

    (F) discharging droplets of a second insulating material including a second photo-curable material to form a second insulating material pattern that covers the wiring pattern and the surface of the object which has been made lyophilic, and surrounds the first insulating pattern; and

    (G) curing the second insulating material pattern to form a second insulating pattern that surrounds the first insulating pattern.

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