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Wiring pattern formation method, wiring pattern, and electronic device

  • US 20060068616A1
  • Filed: 09/13/2005
  • Published: 03/30/2006
  • Est. Priority Date: 09/28/2004
  • Status: Active Grant
First Claim
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1. A method of forming a wiring pattern in which a plurality of electrical wirings deposited to be multilayered are conductively connected to one another through a conducting post, the method comprising:

  • forming the electrical wiring by discharging a first droplet including a material for forming the electrical wiring; and

    forming the conducting post by discharging a second droplet including a material for forming the conducting post;

    wherein a volume of the second droplet is greater than a volume of the first droplet.

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