Micro-electro-mechanical structure having electrically insulated regions and manufacturing process thereof
First Claim
1. A micro-electro-mechanical structure comprising:
- a substrate of semiconductor material;
a suspended mass extending above said substrate, said suspended mass being separated from said substrate by an air gap and being supported by anchoring regions;
at least one insulating region of a first electrically insulating material, extending through said suspended mass and dividing said suspended mass into at least one first electrically insulated suspended region and one second electrically insulated suspended region; and
at least one plug element of a second electrically insulating material different from said first electrically insulating material, said plug element extending underneath said insulating region and forming a barrier between said insulating region and said air gap.
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Accused Products
Abstract
Micro-electro-mechanical structure formed by a substrate of semiconductor material and a suspended mass extending above the substrate and separated therefrom by an air gap. An insulating region of a first electrically insulating material extends through the suspended mass and divides it into at least one first electrically insulated suspended region and one second electrically insulated suspended region. A plug element of a second electrically insulating material different from the first electrically insulating material is formed underneath the insulating region and constitutes a barrier between the insulating region and the air gap for preventing removal of the insulating region during fabrication, when an etching agent is used for removing a sacrificial layer and forming the air gap.
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Citations
27 Claims
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1. A micro-electro-mechanical structure comprising:
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a substrate of semiconductor material;
a suspended mass extending above said substrate, said suspended mass being separated from said substrate by an air gap and being supported by anchoring regions;
at least one insulating region of a first electrically insulating material, extending through said suspended mass and dividing said suspended mass into at least one first electrically insulated suspended region and one second electrically insulated suspended region; and
at least one plug element of a second electrically insulating material different from said first electrically insulating material, said plug element extending underneath said insulating region and forming a barrier between said insulating region and said air gap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A process for manufacturing micro-electro-mechanical structures having electrically insulated adjacent suspended regions, comprising the steps of:
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forming a sacrificial layer above a substrate;
forming a structural layer above said sacrificial layer;
removing selectively portions of said structural layer according to a predetermined layout;
partially removing said sacrificial layer using etching agents for forming suspended regions;
prior to forming said structural layer, forming at least one plug element of material resistant to said etching agents;
prior to partially removing said sacrificial layer, forming at least one insulating trench in said structural layer, in a position overlying and aligned to said plug element; and
filling said insulating trench with insulating material. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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20. A micro-electro-mechanical device, comprising:
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a substrate of semiconductor material having a first surface defining a first plane; and
a first suspended mass movably suspended from the substrate and having second and third surfaces defining second and third planes substantially parallel to the first plane, the first suspended mass including a first insulating region extending through the first suspended mass along a fourth plane substantially perpendicular to the second and third planes, and separating the suspended mass into first and second regions electrically isolated from each other. - View Dependent Claims (21, 22, 23, 24, 25)
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26. A micro-electro-mechanical device, comprising:
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a substrate of semiconductor material having a first surface defining a first plane;
a suspended mass movably suspended from the substrate and having second and third surfaces defining second and third planes substantially parallel to the first plane, the suspended mass including an insulating region extending through the suspended mass along a fourth plane substantially perpendicular to the second and third planes, and separating the suspended mass into first and second regions electrically isolated from each other; and
protecting means for protecting the insulating region from manufacturing processes carried out after formation of the insulating region. - View Dependent Claims (27)
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Specification