System and method for detecting cracks and their location

• US 20060070450A1
• Filed: 09/12/2005
• Published: 04/06/2006
• Est. Priority Date: 09/13/2004
• Status: Active Grant

• Current Assignee: United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration
• Original Assignee: U.S.A. as represented by the Administrator of the National Aeronautics and Space Administration
• Inventors: Woodard, Stanley E., Shams, Qamar A.
• Granted Patent: US 7,231,832 B2
• Time in Patent Office: Days
• US Class Current: 73/767
• CPC Class Codes: G01N 19/08 Detecting presence of flaws or irregularities
• CPC Class Codes: G01N 2203/0005 Repeated or cyclic
• CPC Class Codes: G01N 2203/005 Electromagnetic means
• CPC Class Codes: G01N 2203/0062 Crack or flaws
• CPC Class Codes: G01N 2203/0635 using magnetic properties
• CPC Class Codes: G01N 3/38 generated by electromagnetic means
• CPC Class Codes: G01N 33/38 Concrete; ceramics; glass; bricks

Abstract

A system and method are provided for detecting cracks and their location in a structure. A circuit coupled to a structure has capacitive strain sensors coupled sequentially and in parallel to one another. When excited by a variable magnetic field, the circuit has a resonant frequency that is different for unstained and strained states. In terms of strained states, the resonant frequency is indicative of a region of the circuit that is experiencing strain induced by strain in a region of the structure in proximity to the region of the circuit. An inductor is electrically coupled to one end of each circuit. A magnetic field response recorder wirelessly transmits the variable magnetic field to the inductor and senses the resonant frequency of the circuit so-excited by the variable magnetic field.

Claims

1. A system for detecting cracks and their location in a structure, comprising:

at least one circuit coupled to a structure, each said circuit having a plurality of capacitive strain sensors coupled sequentially and in parallel to one another wherein, when excited by a variable magnetic field, said circuit has a resonant frequency that is (i) a first resonant frequency when said circuit is in an unstrained state, (ii) one of a plurality of second resonant frequencies when said circuit is in a strained state, (iii) a third resonant frequency when said circuit has been broken and the remaining active circuit is in an unstrained state, said third resonant frequency being substantially different in frequency from said first resonant frequency, and (iv) one of a plurality of fourth resonant frequencies when said circuit is broken and the remaining active circuit is in a strained state, said fourth resonant frequencies being substantially different in frequency from said plurality of second resonant frequencies, each of said plurality of second resonant frequencies being indicative of a region of said circuit that is experiencing strain induced by strain in a region of the structure in proximity to said region of said circuit, said third resonant frequency being indicative of a region of said circuit that is broken, and each of said fourth resonant frequencies being indicative of a region of said remaining active circuit that is strained;

an inductor electrically coupled to one end of each said circuit; and

a magnetic field response recorder for wirelessly transmitting said variable magnetic field to said inductor and for sensing said resonant frequency of said circuit so-excited by said variable magnetic field.

2. A system as in claim 1 wherein each of said capacitive strain sensors comprises interdigitated electrodes.

3. A system as in claim 1 wherein said structure is made from a homogenous material, and wherein said circuit is coupled to a surface of the homogenous material.

4. A system as in claim 1 wherein said structure is made from layers of material, and wherein said at least one circuit comprises a plurality of said circuits interposed between said layers.

5. A system as in claim 1 where said structure is made from an electrically non-conductive material, and wherein said circuit comprises thin-film metal conductors deposited directly on the structure.

6. A system as in claim 1 wherein said structure is made from an electrically conductive material, and wherein said circuit comprises:

a thin-film electrical insulator deposited directly on said structure; and

thin-film metal conductors deposited directly on said thin-film electrical insulator.

7. A system as in claim 1 wherein said structure is made from a curable material that is in the process of curing, and wherein said circuit is immersed in the curable material and comprises:

a substrate; and

thin-film metal conductors deposited directly on said substrate.

8. A system for detecting cracks and their location in a structure, comprising:

at least one circuit partially coupled to a structure, each said circuit having N capacitive strain sensors coupled sequentially and in parallel to one another with a first through (N-1) capacitive stain sensors coupled to the structure and an N-th capacitive strain sensor being uncoupled from the structure wherein, when excited by a variable magnetic field, said circuit has a resonant frequency that is (i) a first resonant frequency when said circuit is in an unstrained state, (ii) one of a plurality of second resonant frequencies when said circuit is in a strained state, (iii) a third resonant frequency when said circuit has been broken and the remaining active circuit is in an unstrained state, said third resonant frequency being substantially different in frequency from said first resonant frequency, and (iv) one of a plurality of fourth resonant frequencies when said circuit is broken and the remaining active circuit is in a strained state, said fourth resonant frequencies being substantially different in frequency from said plurality of second resonant frequencies, each of said plurality of second resonant frequencies being indicative of a region of said circuit that is experiencing strain induced by strain in a region of the structure in proximity to said region of said circuit, said third resonant frequency being indicative of a region of said circuit that is broken, and each of said fourth resonant frequencies being indicative of a region of said remaining active circuit that is strained;

an inductor electrically coupled to one end of each said circuit via said N-th capacitive strain sensor associated therewith; and

a magnetic field response recorder for wirelessly transmitting said variable magnetic field to said inductor and for sensing said resonant frequency of said circuit so-excited by said variable magnetic field.

9. A system as in claim 8 wherein each of said N capacitive strain sensors comprises interdigitated electrodes.

10. A system as in claim 8 wherein said structure is made from a homogenous material, and wherein said first through (N-1) capacitive stain sensors are coupled to a surface of said homogenous material.

11. A system as in claim 8 wherein said structure is made from layers of material, and wherein said at least one circuit comprises a plurality of said circuits interposed between said layers.

12. A system as in claim 8 wherein said structure is made from an electrically non-conductive material, and wherein said first through (N-1) capacitive stain sensors comprises thin-film metal conductors deposited directly on the structure.

13. A system as in claim 8 wherein said structure is made from an electrically conductive material, and wherein said first through (N-1) capacitive stain sensors comprise:

a thin-film electrical insulator deposited directly on said structure; and

thin-film metal conductors deposited directly on said thin-film electrical insulator.

14. A system as in claim 8 where said structure is made from a curable material that is in the process of curing, and wherein said first through (N-1) capacitive stain sensors are immersed in the curable material.

15. A method of detecting cracks and their location in a structure, comprising the steps of:

providing a circuit that includes a plurality of capacitive strain sensors coupled sequentially and in parallel to one another;

coupling at least a portion of said circuit to a structure;

coupling an inductor to one end of said circuit;

inducing a variable magnetic field in said inductor wherein, when excited by said variable magnetic field, said circuit has a resonant frequency that is (i) a first resonant frequency when said circuit is in an unstrained state, (ii) one of a plurality of second resonant frequencies when said circuit is in a strained state, (iii) a third resonant frequency when said circuit has been broken and the remaining active circuit is in an unstrained state, said third resonant frequency being substantially different in frequency from said first resonant frequency, and (iv) one of a plurality of fourth resonant frequencies when said circuit is broken and the remaining active circuit is in a strained state, said fourth resonant frequencies being substantially different in frequency from said plurality of second resonant frequencies, each of said plurality of second resonant frequencies being indicative of a region of said circuit that is experiencing strain induced by strain in a region of the structure in proximity to said region of said circuit, said third resonant frequency being indicative of a region of said circuit that is broken, and each of said fourth resonant frequencies being indicative of a region of said remaining active circuit that is strained; and

sensing said resonant frequency of said circuit so-excited by said variable magnetic field.

16. A method according to claim 15 wherein said structure is made from a homogenous material, and wherein said circuit is coupled to a surface of said homogenous material.

17. A method according to claim 15 wherein said structure is made from layers of material, and wherein said circuit is interposed between two of the layers.

18. A method according to claim 15 where said structure is made from an electrically non-conductive material, and wherein said step of coupling said circuit to the structure comprises the step of depositing thin-film metal conductors directly on the structure.

19. A method according to claim 15 wherein said structure is made from an electrically conductive material, and wherein said step of coupling said circuit to the structure comprises the steps of:

depositing a thin-film electrical insulator directly on said structure; and

depositing thin-film metal conductors directly on said thin-film electrical insulator.

20. A method according to claim 15 wherein said structure is made from a curable material that is in the process of curing, and wherein said step of coupling said circuit to said structure comprises the step of immersing said circuit in said curable material.

21. A system for detecting cracks and their location in a structure, comprising:

at least one circuit coupled to a structure, each said circuit having at least three capacitive strain sensors wherein, when excited by a variable magnetic field, said circuit has a resonant frequency that is (i) a first resonant frequency when said circuit is in an unbroken state, and (ii) one of a plurality of second resonant frequencies when said circuit is in a broken state, each of said plurality of second resonant frequencies being indicative of a region of said circuit that is broken;

at least two inductors electrically coupled to each said capacitive strain sensor, wherein each inductor is positioned between two capacitive strain sensors; and

a magnetic field response recorder for wirelessly transmitting said variable magnetic field to said one or more inductors and for sensing said resonant frequency of said circuit so-excited by said variable magnetic field.

22. A system as in claim 21 wherein each of said capacitive strain sensors comprises interdigitated electrodes.

23. A system as in claim 21 wherein said circuit is deposited on a substrate affixed to the structure.

24. A system as in claim 23 wherein said substrate can be easily broken.

25. A system as in claim 23 wherein said substrate is tape having a low in-plane strength.

26. A system as in claim 24 wherein said breaking of said substrate is indicative of tampering with said structure.

27. A method of detecting product tampering, comprising the steps of:

providing a circuit that comprises at least three capacitive strain sensors;

coupling at least a portion of said circuit to a structure;

coupling at least two inductors to each capacitive strain sensor, wherein each inductor is positioned between two capacitive strain sensors;

inducing a variable magnetic field in each inductor wherein, when excited by said variable magnetic field, said circuit has a resonant frequency that is (i) a first resonant frequency when said circuit is in an unstrained state, and (ii) one of a plurality of second resonant frequencies when said circuit is in a strained state, each of said plurality of second resonant frequencies being indicative of a region of said circuit that is experiencing strain induced by strain in a region of the structure in proximity to said region of said circuit; and

sensing said resonant frequency of said circuit so-excited by said variable magnetic field.

28. A system as in claim 27 wherein said circuit is deposited on a substrate affixed to the structure.

29. A system as in claim 28 wherein said substrate can be easily broken.

30. A system as in claim 29 wherein said substrate is tape having a low in-plane strength.

31. A system as in claim 29 wherein said breaking of said substrate is indicative of tampering with said structure.