Process for manufacture of novel, inexpensive radio frequency identification devices

• US 20060071084A1
• Filed: 12/14/2001
• Published: 04/06/2006
• Est. Priority Date: 12/15/2000
• Status: Abandoned Application

• Current Assignee: Electrox Limited
• Original Assignee: Electrox Limited
• Inventors: Detig, Robert H, Bremberg, Vernon L
• Application Number:
  US10/539,158
• Publication Number:
  US 20060071084A1
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07756 the connection being non-galvanic, e.g. capacitive
• CPC Class Codes: G06K 19/07775 the antenna being on-chip
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 19/07784 the inductive antenna consisting of a plurality of coils stacked on top of one another
• CPC Class Codes: G08B 13/2417 having a radio frequency identification chip
• CPC Class Codes: G08B 13/2437 Tag layered structure, processes for making layered tags
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29298 Fillers
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/44 : using equipment having another main function to serve additionally as an antenna , e.g. means for giving an antenna an aesthetic aspectH01Q1/27 - H01Q1/34 take precedence
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/27 : Spiral antennas
• CPC Class Codes: Y10T 29/49018 : with other electrical component

Abstract

A novel process for fabricating low cost RFID devices in which a pattern of metallic toner is printed on a substrate and the contacts on a silicon die are placed directly on contact points printed as part of the pattern of metallic toner; the whole device is then heated to both cure the metallic toner into metallic conductors and bond the silicon die to the metallic conductors. Alternatively, the silicon die can be physically attached to the substrate and the electrical pathway between the silicon die and the metallic conductors is established via a transformer coupling comprised of a coil winding on the silicon die and a pattern of coils printed as part of the metallic toner pattern. The pattern of coils can be comprised of individually printed coil loops printed on, and separated by, dielectric layers.

Claims

1. An RFID device comprising

a substrate;

an antenna means on said substrate, said antenna means being comprised of a metal toner printed in a pattern comprising at least one loop;

at least one silicon chip; and

a connection means for electrically connecting said antenna means and said silicon chip.

2. The RFID device of claim 1 wherein said connection means is comprised of an electrically conductive adhesive.

3. The RFID device of claim 1 wherein said connection means is comprised of:

a first coil means connected to said antenna means and a second coil means connected to said silicon chip.

wherein said first coil means and said second coil means are proximally located thereby facilitating electrical communication.

4. The RFID device of claim 3 wherein said first coil means is comprised of at least two loops wherein each of said at least two loops is separated by a layer of dielectric.

5. The RFID device of claim 4 wherein said first coil means has at least a first and a second loop each loop having two endpoints,

wherein a first loop is located on said substrate and

a second loop is located on a dielectric layer located above said first loop,

wherein one endpoint of said first loop is connected to said antenna means and the second endpoint of said first loop is connected to the first endpoint of said second loop through a hole in the dielectric layer and

wherein the second endpoint of said second loop is connected to said antenna means through an opening in the dielectric layer.

6. The RFID device of claim 3 wherein said first coil means is comprised of at least two loops wherein each of said at least two loops is separated by a layer of dielectric.

7. The RFID device of claim 3 wherein said second coil means is located on said silicon chip.

8. The RFID device of claim 1 wherein said antenna means is printed on said substrate.

9. The RFID device of claim 8 wherein printing is by electrostatic or inkjet printing methods.

10. The RFID device of claim 3 wherein said connection means is printed by electrostatic or inkjet printing methods.

11. The RFID device of claim 7 wherein said second coil means is printed by electrostatic or inkjet printing methods.

12. The RFID device of claim 1 further comprising a protective coating.

13. A process for the manufacture of RFID devices consisting of the following:

a. Electrostatic printing of a metal toner on a coated substrate, said printing comprising an antenna having at least one loop;

b. The drying of this metal toner image;

c. The mechanical placement of a silicon die on this dried, printed metal toner image;

d. The heating of this assembly to a suitable temperature causing a sintering of the metal toner particles together and a sintering of them to the electrode pads of the silicon die; and

e. The overcoat of the die/substrate with a protective coat.

14. The process of claim 13 in which the metal toner is made of silver.

15. The process of claim 13 in which the substrate is PET film or paper.

16. The process of claim 13 in which the substrate is coated with an adhesion/sintering layer that promotes both sintering of the metal particles and their adhesion to the substrates.

17. The process of claim 16 in which this coating is chosen from Saran™

resins of Dow Chemical.

18. A process for the manufacture of rf-ID devices in which:

a. metal toner is printed on a suitable substrate in a suitable pattern;

b. the pattern in the area of silicon chip mounting is configured into a single or multui-turn electro-magnetic coil;

c. this pattern is suitably processed into a conductive metal pattern;

d. the substrate is coated with a suitable adhesive layer;

e. a silicon die possessing an electromagnetic coil pattern of metal around its periphery is placed and aligned to the metal toner coil pattern of the substrate; and

f. the bonding reaction between die and adhesive coated substrate is completed by suitable means.

19. The process of claim 18 in which the die has been “

thinned”

to a value below 50 microns.

20. The process of claim 18 where the substrate thickness is less than 50 microns.

21. The process of claim 18 where the overall thickness of the final part is between 10 and 100 microns.