Process for manufacture of novel, inexpensive radio frequency identification devices
First Claim
1. An RFID device comprising a substrate;
- an antenna means on said substrate, said antenna means being comprised of a metal toner printed in a pattern comprising at least one loop;
at least one silicon chip; and
a connection means for electrically connecting said antenna means and said silicon chip.
1 Assignment
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Accused Products
Abstract
A novel process for fabricating low cost RFID devices in which a pattern of metallic toner is printed on a substrate and the contacts on a silicon die are placed directly on contact points printed as part of the pattern of metallic toner; the whole device is then heated to both cure the metallic toner into metallic conductors and bond the silicon die to the metallic conductors. Alternatively, the silicon die can be physically attached to the substrate and the electrical pathway between the silicon die and the metallic conductors is established via a transformer coupling comprised of a coil winding on the silicon die and a pattern of coils printed as part of the metallic toner pattern. The pattern of coils can be comprised of individually printed coil loops printed on, and separated by, dielectric layers.
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Citations
21 Claims
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1. An RFID device comprising
a substrate; -
an antenna means on said substrate, said antenna means being comprised of a metal toner printed in a pattern comprising at least one loop;
at least one silicon chip; and
a connection means for electrically connecting said antenna means and said silicon chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A process for the manufacture of RFID devices consisting of the following:
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a. Electrostatic printing of a metal toner on a coated substrate, said printing comprising an antenna having at least one loop;
b. The drying of this metal toner image;
c. The mechanical placement of a silicon die on this dried, printed metal toner image;
d. The heating of this assembly to a suitable temperature causing a sintering of the metal toner particles together and a sintering of them to the electrode pads of the silicon die; and
e. The overcoat of the die/substrate with a protective coat. - View Dependent Claims (14, 15, 16, 17)
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18. A process for the manufacture of rf-ID devices in which:
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a. metal toner is printed on a suitable substrate in a suitable pattern;
b. the pattern in the area of silicon chip mounting is configured into a single or multui-turn electro-magnetic coil;
c. this pattern is suitably processed into a conductive metal pattern;
d. the substrate is coated with a suitable adhesive layer;
e. a silicon die possessing an electromagnetic coil pattern of metal around its periphery is placed and aligned to the metal toner coil pattern of the substrate; and
f. the bonding reaction between die and adhesive coated substrate is completed by suitable means. - View Dependent Claims (19, 20, 21)
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Specification