Semiconductor package including light emitter and IC

• US 20060071220A1
• Filed: 09/28/2005
• Published: 04/06/2006
• Est. Priority Date: 10/06/2004
• Status: Active Grant

• Current Assignee: Siliconware Precision Industries Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Siliconware Precision Industries Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: Chang, Yi-Feng, Chang, Chin-Huang, Lu, Wei Lung, Liu, Cheng Jen
• Granted Patent: US 7,339,199 B2
• Time in Patent Office: Days
• US Class Current: 257/82
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

The is to disclose a semiconductor package featuring inclusion of light emitter(s) providing light to indicate the states of the semiconductor package as a whole and/or the chip(s) therein. The light emitter is in an original state or flashing state or emitting state according to the states of the semiconductor package as a whole and/or the chip(s). The semiconductor package includes a carrier and a shield structure in addition to the light emitter. The chip and at least part of the carrier are covered by the shield structure. The light emitter may be partially or fully covered or sealed by the shield structure. The light emitter may also be partially or fully exposed. The shield structure is such that the light provided by the light emitter sealed therein can pass therethrough to reach the outside thereof, thereby the states of the semiconductor package as a whole and/or the chip(s) can be recognized from the outside of the semiconductor package.

Claims

1. A semiconductor package comprising:

a carrier;

at least a chip attached to said carrier;

at least a light emitter electrically connecting said chip, and being in one of the states including original state, flashing state providing flashing light, and emitting state providing light; and

a shield structure covering said chip, said light emitter, and at least part of said carrier, and being such that at least part of the light provided by said light emitter pass therethrough to reach the outside thereof.

2. The semiconductor package according to claim 1 wherein said carrier includes a first surface, said chip is attached to the first surface of said carrier, said chip, said light emitter, and at least part of said first surface are covered by said shield structure.

3. The semiconductor package according to claim 2 wherein said light emitter connects the first surface of said carrier.

4. The semiconductor package according to claim 1 further comprising a connection unit for electrically connecting said light emitter to said chip, said connection unit being covered by said shield structure.

5. The semiconductor package according to claim 1 wherein said shield structure includes a cavity sinking toward said light emitter from the outside of said shield structure.

6. The semiconductor package according to claim 5 wherein the maximum distance from said light emitter to the outside of said shield structure is 10 mils.

7. The semiconductor package according to claim 1 wherein said light emitter electrically connects said chip via said carrier.

8. The semiconductor package according to claim 1 wherein said chip lies between said light emitter and said carrier.

9. The semiconductor package according to claim 1 wherein said light emitter lies between said chip and part of said shield structure.

10. The semiconductor package according to claim 1 wherein said chip includes an integrated circuit.

11. The semiconductor package according to claim 1 further comprising a plurality of connection lines for electrically connecting said chip to said carrier, said connection lines being covered by said shield structure.

12. The semiconductor package according to claim 1 further comprising an adhesive for connecting said chip to said carrier and connecting said light emitter to at least one of said carrier and said chip.

13. A semiconductor package comprising:

a carrier;

at least a chip attached to said carrier;

at least a light emitter electrically connecting said chip, and being in one of the states including original state, flashing state providing flashing light, and emitting state providing light; and

a shield structure covering said chip, a first part of said light emitter, and at least part of said carrier, a second part of said light emitter being exposed to the outside of said shield structure.

14. The semiconductor package according to claim 13 wherein said light emitter is such that said original state, said flashing state, and said emitting state, respectively correspond to different states of said chip.

15. The semiconductor package according to claim 13 wherein said light emitter is such that said original state, said flashing state, and said emitting state, respectively correspond to different states of at least a signal associated with said chip.

16. The semiconductor package according to claim 13 wherein said light emitter is such that said original state, said flashing state, and said emitting state, respectively correspond to different states of said semiconductor package.

17. A semiconductor package comprising:

a carrier;

at least a chip attached to said carrier;

at least a light emitter electrically connecting said chip, and being in one of the states including original state, flashing state providing flashing light, and emitting state providing light; and

a shield structure covering said chip, said light emitter, and at least part of said carrier, and including a thin portion which provides a light path between said light emitter and the outside of said shield structure, for the light provided by said light emitter to pass therethrough to reach the outside of said shield structure.

18. The semiconductor package according to claim 17 wherein the length of said light path is at most 10 mils

19. A semiconductor package comprising:

a carrier;

at least an chip attached to said carrier;

at least a light emitter electrically connecting said chip, and being in one of the states including original state, flashing state providing flashing light, and emitting state providing light; and

a shield structure covering said chip, said light emitter, and at least part of said carrier, and allowing the light provided by said light emitter to propagate therethrough.

20. A semiconductor package comprising:

a carrier;

at least an chip attached to said carrier;

at least a light emitter electrically connecting said chip, and being in one of the states including original state, flashing state providing flashing light, and emitting state providing light; and

a shield structure covering said chip, and at least part of said carrier.