×

Apparatus for and method of cooling molded electronic circuits

  • US 20060076124A1
  • Filed: 09/06/2005
  • Published: 04/13/2006
  • Est. Priority Date: 09/07/2004
  • Status: Active Grant
First Claim
Patent Images

1. A compact power conversion device comprising:

  • a) a power conversion circuit coupled to receive electric power from a power supply network via power supply leads; and

    , b) a heat conductive body thermally coupled with the power conversion circuit for substantially efficient heat transfer from the power conversion circuit and to the power supply leads, such that heat generated by the power conversion circuit is conductively transferred to the power supply network.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×