System and method for display device with activated desiccant

• US 20060076632A1
• Filed: 05/27/2005
• Published: 04/13/2006
• Est. Priority Date: 09/27/2004
• Status: Abandoned Application

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Inventors: Gally, Brian J., Palmateer, Lauren, Cummings, William J., Sampsell, Jeffrey
• Application Number:
  US11/140,498
• Publication Number:
  US 20060076632A1
• Time in Patent Office: Days
• US Class Current: 257/414
• CPC Class Codes: B81C 1/00285 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

A MEMS device package comprises a substrate with a MEMS device formed thereon, a backplane, a seal, and an inactive desiccant within the package. The desiccant is activated after assembly of the package by exposure to an environmental change or an activating substance. A method of packaging a MEMS device comprises activating a desiccant and contacting a substrate with the MEMS device formed thereon, a seal, and a backplane, wherein the desiccant is disposed on the substrate or the backplane.

Claims

1. A microelectromechanical system (MEMS) device apparatus, comprising:

a substrate;

a MEMS device formed on said substrate;

a backplane sealed to said substrate to form a MEMS device package; and

an inactive desiccant positioned within said package.

2. The MEMS device apparatus of claim 1, wherein said MEMS device package further comprises an aperture in at least one of said backplane and said seal.

3. The MEMS device apparatus of claim 1, wherein said inactive desiccant comprises a protective layer over one or more layers of desiccant.

4. The MEMS device apparatus of claim 1, wherein said inactive desiccant is configured for activation in response to an application of heat.

5. The MEMS device apparatus of claim 1, wherein said inactive desiccant is configured for activation in response to an application of UV light.

6. The MEMS device apparatus of claim 1, wherein said inactive desiccant is disposed on said backplane.

7. The MEMS device apparatus of claim 1, wherein the MEMS device comprises an interferometric modulator device.

8. The MEMS device apparatus of claim 1, wherein said apparatus comprises a display system comprising:

a processor that is in electrical communication with said MEMS device, said processor being configured to process image data; and

a memory device in electrical communication with said processor.

9. The MEMS device apparatus as recited in claim 8, further comprising:

a first controller configured to send at least one signal to said MEMS device; and

a second controller configured to send at least a portion of said image data to said first controller.

10. The MEMS device apparatus as recited in claim 8, further comprising:

an image source module configured to send said image. data to said processor.

11. The MEMS device as recited in claim 10, wherein said image source module comprises at least one of a receiver, transceiver, and transmitter.

12. The MEMS device as recited in claim 8, further comprising:

an input device configured to receive input data and to communicate said input data to said processor.

13. A method of packaging a microelectromechanical system (MEMS) device, comprising:

providing a MEMS device package comprising a substrate comprising a MEMS device formed thereon, a backplane sealed to said substrate to encapsulate said MEMS device, and an inactive desiccant positioned within said MEMS device package; and

activating said desiccant.

14. The method of claim 13, wherein said desiccant is disposed on said backplane.

15. The method of claim 13, wherein said desiccant is disposed on said substrate.

16. The method of claim 13, wherein activating said desiccant comprises removing a protective layer from a surface of said desiccant.

17. The method of claim 13, wherein activating said desiccant comprises exposing said desiccant to heat.

18. The method of claim 13, wherein activating said desiccant comprises exposing said desiccant to UV light.

19. The method of claim 13, wherein activating said desiccant comprises contacting said inactive desiccant with a substance through an aperture in at least one of said backplane, said seal, and said substrate.

20. The method of claim 13, wherein said inactive desiccant comprises a protective layer positioned over a desiccant, and wherein activating said desiccant comprises removing said protective layer.

21. The method of claim 20, wherein removing said protective layer comprises exposing said desiccant to heat.

22. The method of claim 19, wherein said substance is one of a gas, a liquid, and a plasma.

23. The method of claim 19, further comprising filling said aperture with a substance so as to seal the MEMS device package from ambient conditions.

24. A method of packaging an microelectromechanical system (MEMS) device, comprising:

activating a desiccant; and

contacting a substrate, a seal, and a backplane so as to encapsulate a MEMS device formed on said substrate and said activated desiccant.

25. The method of claim 24, wherein activating said desiccant comprises removing one or more protective layers from a surface of the desiccant.

26. The method of claim 25, wherein the one or more protective layers comprises a self-contained sheet.

27. The method of claim 24, wherein activating said desiccant comprises exposing said desiccant to UV light.

28. A microelectromechanical system (MEMS) device package produced by the method comprising:

providing a MEMS device package comprising a substrate comprising a MEMS device formed thereon, a backplane sealed to said substrate to encapsulate said MEMS device, and an inactive desiccant positioned within said MEMS device package; and

activating said desiccant.

29. The MEMS device package of claim 28, wherein said desiccant is disposed on said backplane.

30. The MEMS device package of claim 28, wherein said desiccant is disposed on said substrate.

31. The MEMS device package of claim 28, wherein activating said desiccant comprises removing a protective layer from a surface of said desiccant.

32. The MEMS device package of claim 28, wherein activating said desiccant comprises exposing said desiccant to heat.

33. The MEMS device package of claim 28, wherein activating said desiccant comprises exposing said desiccant to UV light.

34. The MEMS device package of claim 28, wherein activating said desiccant comprises contacting said inactive desiccant with a substance through an aperture in at least one of said backplane, said seal, and said substrate.

35. The MEMS device package of claim 28, wherein said inactive desiccant comprises a protective layer over a desiccant, and wherein activating said desiccant comprises removing said protective layer.

36. The MEMS device package of claim 34, further comprising filling said aperture with a substance so as to seal the MEMS device package from ambient conditions.

37. The MEMS device package of claim 28, wherein the MEMS device comprises an interferometric modulator device.

38. A microelectromechanical system (MEMS) device package produced by the method comprising:

activating a desiccant; and

contacting a substrate, a seal, and a backplane so as to encapsulate a MEMS device formed on said substrate and said activated desiccant.

39. The MEMS device package of claim 38, wherein activating said desiccant comprises removing one or more protective layers from a surface of the desiccant.

40. The MEMS device package of claim 38, wherein activating said desiccant comprises exposing said desiccant to UV light.

41. The MEMS device package of claim 38, wherein the MEMS device comprises an interferometric modulator device.

42. A system for packaging a microelectromechanical system (MEMS) device, comprising:

a MEMS device package comprising a substrate comprising a MEMS device formed thereon, a backplane sealed to said substrate to encapsulate said MEMS device, and an inactive desiccant positioned within said MEMS device package; and

means for activating said desiccant.

43. The system of claim 42, wherein said means for activating said desiccant comprises means for removing a protective layer from a surface of said desiccant.

44. The system of claim 42, wherein said means for activating said desiccant comprises means for exposing said desiccant to heat.

45. The system of claim 42, wherein said means for activating said desiccant comprises means for exposing said desiccant to UV light.

46. The system of claim 42, wherein said means for activating said desiccant comprises means for contacting said inactive desiccant with a substance.

47. The system of claim 46, wherein said means for contacting said inactive desiccant with said substance comprises an aperture in at least one of said backplane, said seal, and said substrate.

48. The system of claim 46, wherein said inactive desiccant comprises a protective layer positioned over a desiccant, and wherein said substance is configured to remove said protective layer.

49. The system of claim 47, further comprising means for filling said aperture so as to seal the MEMS device package from ambient conditions.