Method and system for packaging MEMS devices with incorporated getter

• US 20060076634A1
• Filed: 04/08/2005
• Published: 04/13/2006
• Est. Priority Date: 09/27/2004
• Status: Abandoned Application

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Inventors: Palmateer, Lauren, Chui, Clarence, Cummings, William J., Kothari, Manish, Gally, Brian
• Application Number:
  US11/102,554
• Publication Number:
  US 20060076634A1
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: B81B 7/0038 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

Claims

1. A microelectromechanical system (MEMS) device package, comprising:

a substrate;

a MEMS device formed on said substrate;

a backplane; and

a seal positioned proximate a perimeter of the MEMS device and in contact with said substrate and said backplane, wherein said seal comprises a chemically reactant getter.

2. The MEMS system of claim 1, wherein said seal comprises an amount of getter sufficient to getter substantially all substances outgassed from said seal during at least one of manufacture and assembly.

3. The MEMS system of claim 1, wherein said seal comprises an adhesive.

4. The MEMS system of claim 1, wherein said chemically reactant getter comprises at least one of calcium oxide, strontium, strontium oxide, and an aluminum complex.

5. A microelectromechanical system (MEMS) device package, comprising:

a substrate;

a MEMS device formed on said substrate;

a backplane;

a primary seal positioned proximate a perimeter of the MEMS device and in contact with said substrate and said backplane, wherein said primary seal includes a getter; and

a secondary seal positioned proximate said primary seal at an outer periphery.

6. The MEMS device package of claim 5, wherein said secondary seal comprises a hydrophobic material.

7. The MEMS device package of claim 5, wherein said getter comprises a desiccant.

8. The MEMS device package of claim 5, wherein said primary seal comprises an adhesive.

9. A microelectromechanical system (MEMS) device package, comprising:

a substrate;

a MEMS device formed on said substrate;

a backplane;

a seal positioned around a periphery of said MEMS device and in contact with said substrate and said backplane; and

a getter positioned proximate said seal at an inner periphery.

10. The MEMS device package of claim 9, wherein said seal comprises at least one of a metal and an adhesive.

11. The MEMS device package of claim 9, wherein said getter comprises a desiccant.

12. The MEMS device package of claim 9, wherein said getter is positioned in contact with said seal.

13. A method of sealing a microelectromechanical system (MEMS) device package, comprising:

forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device, and wherein said seal comprises a chemically reactant getter; and

attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.

14. The method of claim 13, wherein said seal comprises an amount of getter sufficient to getter substantially all substances outgassed from said seal during at least one of manufacture and assembly.

15. The method of claim 13, wherein said seal comprises an adhesive.

16. The method of claim 13, wherein said chemically reactant getter comprises at least one of calcium oxide, strontium, strontium oxide, and an aluminum complex.

17. A microelectromechanical system (MEMS) device package produced by the method comprising:

forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device, and wherein said seal comprises a chemically reactant getter; and

attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.

18. The MEMS device package of claim 17, wherein said seal comprises an amount of getter sufficient to getter substantially all substances outgassed from said seal during at least one of manufacture and assembly.

19. The MEMS device package of claim 17, wherein said seal comprises an adhesive.

20. The MEMS device package of claim 17, wherein said chemically reactant getter comprises at least one of calcium oxide, strontium, strontium oxide, and an aluminum complex.

21. A system for sealing a microelectromechanical system (MEMS) device package, comprising:

means for forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device, and wherein said seal comprises a chemically reactant desiccant; and

means for attaching said substrate, said seal, and said backplane to thereby encapsulate said MEMS device.

22. The system of claim 21, wherein said seal comprises an amount of getter sufficient to getter substantially all substances outgassed from said seal during at least one of manufacture and assembly.

23. The system of claim 21, wherein said chemically reactant getter comprises at least one of calcium oxide, strontium, strontium oxide, and an aluminum complex.

24. A method of sealing a microelectromechanical system (MEMS) device package, comprising:

forming a primary seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said primary seal is formed proximate a perimeter of said MEMS device;

attaching said substrate, said primary seal, and said backplane, thereby encapsulating said MEMS device; and

forming a secondary seal proximate said primary seal at an outer periphery.

25. The method of claim 24, wherein said secondary seal comprises a hydrophobic material.

26. The method of claim 24, wherein said getter comprises a desiccant.

27. The method of claim 24, wherein said primary seal comprises an adhesive.

28. A microelectromechanical system (MEMS) device package produced by the method comprising:

forming a primary seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said primary seal is formed proximate a perimeter of said MEMS device;

attaching said substrate, said primary seal, and said backplane, thereby encapsulating said MEMS device; and

forming a secondary seal proximate said primary seal at an outer periphery.

29. The MEMS device package of claim 28, wherein said secondary seal comprises a hydrophobic material.

30. The MEMS device package of claim 28, wherein said getter comprises a desiccant.

31. The MEMS device package of claim 28, wherein said primary seal comprises an adhesive.

32. A system for sealing a microelectromechanical system (MEMS) device package, comprising:

means for forming a primary seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said primary seal is formed proximate a perimeter of said MEMS device;

means for attaching said substrate, said primary seal, and said backplane, thereby encapsulating said MEMS device; and

means for forming a secondary seal proximate said primary seal at an outer periphery.

33. The system of claim 32, wherein said secondary seal comprises a hydrophobic material.

34. The system of claim 32, wherein said getter comprises a desiccant.

35. A method of sealing a microelectromechanical system (MEMS) device package, comprising:

forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device;

forming a getter positioned proximate said seal at an inner periphery; and

attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.

36. The method of claim 35, wherein said seal comprises at least one of a metal and an adhesive.

37. The method of claim 35, wherein said getter comprises a desiccant.

38. The method of claim 35, wherein said getter is positioned in contact with said seal.

39. A microelectromechanical system (MEMS) device package produced by the method comprising:

forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device;

forming a getter positioned proximate said seal at an inner periphery; and

attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.

40. The MEMS device package of claim 39, wherein said seal comprises at least one of a metal and an adhesive.

41. The MEMS device package of claim 39, wherein said getter comprises a desiccant.

42. The MEMS device package of claim 39, wherein said getter is positioned in contact with said seal.

43. A system for sealing a microelectromechanical system (MEMS) device package, comprising:

means for forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device;

means for forming a getter positioned proximate said seal at an inner periphery; and

means for attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.

44. The system of claim 43, wherein said seal comprises at least one of a metal and an adhesive.

45. The system of claim 43, wherein said getter comprises a desiccant.