Method and system for packaging a display
First Claim
Patent Images
1. A method of packaging a display device, comprising:
- providing a transparent substrate having an interferometric modulator formed thereon; and
joining a backplane to the transparent substrate to form a package by applying a seal between the backplane and the transparent substrate, wherein the interferometric modulator is encapsulated by the package and the package has an opening.
3 Assignments
0 Petitions
Accused Products
Abstract
A package structure and method of packaging for an interferometric modulator. A transparent substrate having an interferometric modulator formed thereon is provided. A backplane is joined to the transparent substrate with a seal where the interferometric modulator is exposed to the surrounding environment through an opening in either the backplane or the seal. The opening is sealed after the transparent substrate and backplane are joined and after any desired desiccant, release material, and/or self-aligning monolayer is introduced into the package structure.
124 Citations
70 Claims
-
1. A method of packaging a display device, comprising:
-
providing a transparent substrate having an interferometric modulator formed thereon; and
joining a backplane to the transparent substrate to form a package by applying a seal between the backplane and the transparent substrate, wherein the interferometric modulator is encapsulated by the package and the package has an opening. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. A microelectromechanical systems based device, comprising:
-
a transparent substrate having a microelectromechanical device formed thereon;
a backplane; and
a sealing means for joining the backplane to the transparent substrate to encapsulate the microelectromechanical device within a package, wherein the sealing means is applied between the backplane and the transparent substrate, wherein either the backplane or sealing means has a sealed opening. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25)
-
-
26. A method of packaging a display device, comprising:
-
providing a transparent substrate having an interferometric modulator formed thereon;
joining a backplane to the transparent substrate to encapsulate the interferometric modulator by applying a seal between the backplane and the transparent substrate, wherein the seal has an opening; and
sealing the opening after joining the backplane to the transparent substrate. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35)
-
-
36. A microelectromechanical systems based device, comprising:
-
a transparent substrate having a microelectromechanical device formed thereon;
a backplane; and
a seal configured to join the backplane to the transparent substrate to encapsulate the microelectromechanical device within a package, wherein the seal is applied between the backplane and the transparent substrate, wherein either the backplane or seal has a sealed opening. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45)
-
-
46. A method of manufacturing a display device, comprising:
-
providing a transparent substrate having a microelectromechanical device formed thereon;
joining a backplane to the transparent substrate to form a package by applying a seal between the backplane and the transparent substrate, wherein the microelectromechanical device is encapsulated by the package and the package has at least one opening; and
reducing water content in the package by introducing a gas through the at least one opening and into the package after joining the backplane to the transparent substrate. - View Dependent Claims (47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57)
-
-
58. A method of manufacturing a display device, comprising:
-
providing a transparent substrate having a microelectromechanical device formed thereon;
depositing a sacrificial layer over the transparent substrate and microelectromechanical device;
depositing a thin film over the sacrificial layer to form a package by adhering the thin film to a perimeter of the transparent substrate, wherein the thin film has at least one opening; and
removing the sacrificial layer by introducing a release material through said at least one opening and into the package. - View Dependent Claims (59, 60, 61, 62, 63, 64)
-
-
65. A display device, comprising:
-
a transparent substrate having a microelectromechanical device formed thereon;
a backplane; and
a sealing means for joining the backplane to the transparent substrate to encapsulate the microelectromechanical device within a package, wherein the sealing means is applied between the backplane and the transparent substrate and the package has at least one endseal, wherein, to remove moisture content within the package, the at least one endseal is configured to allow gas to flow therethrough prior to the at least one endseal being sealed. - View Dependent Claims (66, 67, 68, 69, 70)
-
Specification