Apparatus and method for arranging devices into an interconnected array

• US 20060077126A1
• Filed: 03/11/2005
• Published: 04/13/2006
• Est. Priority Date: 09/27/2004
• Status: Abandoned Application

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Inventors: Kothari, Manish
• Application Number:
  US11/078,025
• Publication Number:
  US 20060077126A1
• Time in Patent Office: Days
• US Class Current: 345/33
• CPC Class Codes: B81B 2201/045 Optical switches
• CPC Class Codes: B81B 7/04 Networks or arrays of similar microstructural devices
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G02F 1/13336 Combining plural substrates to produce large-area displays, e.g. tiled displays
• CPC Class Codes: G09G 2300/026 Video wall, i.e. juxtaposition of a plurality of screens to create a display screen of bigger dimensions
• CPC Class Codes: G09G 2300/06 Passive matrix structure, i.e. with direct application of both column and row voltages to the light emitting or modulating elements, other than LCD or OLED
• CPC Class Codes: G09G 3/3466 based on interferometric effect

Abstract

Apparatus and methods for arranging devices having a reduced area between adjacent devices are provided. In an exemplary embodiment, display devices in an array are provided wherein a gap between the display devices is reduced to less than or equal to ⅛^th of a pixel pitch. Exemplary embodiments use wire bonding to provide an electrical connection to an active area of the display to components on the display backplate, thereby reducing the ledge area and gap between display devices in an interconnected array.

Claims

1. An array of devices, comprising:

a first device, comprising;

a package comprising a substrate, a first active area, and an electrical connection area, wherein said electrical connection area is configured to provide electrical communication with said first active area, wherein the electrical connection area comprises a width of less than 1 millimeter;

a sealant ring circumscribing said first active area;

a backplane joined to said sealant ring to form said package, wherein the electrical connection area is disposed between said seal and an edge of said substrate; and

a second device comprising a second active area and positioned adjacent the electrical connection area of said first device.

2. The array of devices of claim 1, wherein said electrical connection area is configured to provide electrical communication with said first active area via wire bonding.

3. The array of devices of claim 1, wherein a shortest distance between the first active area and the second active area is less than or equal to ⅛

^th of a pixel pitch.

4. The array of devices of claim 1, wherein the array of devices comprises an array of display devices.

5. The array of devices of claim 4, wherein the array of display devices comprises at least one interferometric light modulator.

6. The array of devices of claim 5, wherein the first active area and the second active area each comprise at least one interferometric light modulator.

7. The array of devices of claim 4, wherein the array of display devices is configured to display a single image.

8. The array of devices of claim 4, wherein the array of display devices is configured to display multiple images simultaneously.

9. The array of devices of claim 4, wherein the display devices comprise at least one of the following:

a liquid crystal display (LCD), an organic light-emitting diode (OLED), a light-emitting diodes (LED), a filed-emission displays (FED), an electrochromatic display, or an electrophoretic display.

10. The array of devices of claim 1, wherein the devices comprise one of the following imaging sensing devices:

an x-ray sensor, a complementary oxide semiconductors (CMOS) sensor, a common channel signaling (CCS) sensor, an infrared sensor, or an ultraviolet (UV) sensor.

11. The array of devices of claim 1, wherein the electrical connection area comprises a width of less than or equal to 0.75 millimeters.

12. The array of devices of claim 1, wherein the electrical connection area comprises a width of less than or equal to 0.5 millimeters.

13. The array of devices of claim 1, wherein the electrical connection area comprises a width of less than or equal to 0.25 millimeters.

14. The array of devices of claim 1, wherein the electrical connection area comprises a width of less than or equal to 0.1 millimeters.

15. The array of devices of claim 1, wherein the backplate comprises a printed circuit board.

33. The device of claim 1, wherein the electrical connection area has a width of less than or equal to 0.25 millimeters.

16. A method of manufacturing an array of display devices, comprising:

providing a first display device, comprising;

a display package comprising a substrate, a first active area, and an electrical connection area, wherein said electrical connection area is configured to provide electrical communication with said first active area;

a sealant ring circumscribing said first active area;

a backplane joined to said sealant ring to form said display package;

wherein the electrical connection area is disposed between said seal and an edge of said substrate;

providing a second display device comprising a second active area; and

positioning the first display device and the second display device together such that the active area of the second display device is adjacent the electrical connection area of said first display device, wherein a shortest distance between the first active area and the second active area is less than or equal to ⅛

^th of a pixel pitch.

17. The method of claim 16, wherein the electrical connection area of the first display device comprises a width, wherein the width is less than 1 millimeter.

18. The method of claim 16, wherein the electrical connection area is configured to provide electrical communication via wire bonding.

19. The method of claim 16, wherein the array of display devices comprises at least one interferometric light modulator.

20. The method of claim 19, wherein the first active area and the second active area each comprise at least one interferometric light modulator.

21. An array of display devices produced by a process, comprising:

providing a first display device, comprising;

a display package comprising a substrate, a first active area, and an electrical connection area, wherein said electrical connection area is configured to provide electrical communication with said first active area;

a sealant ring circumscribing said first active area;

a backplane joined to said sealant ring to form said display package;

wherein the electrical connection area is disposed between said seal and an edge of said substrate;

providing a second display device comprising a second active area; and

positioning the first display device and the second display device together such that the active area of the second display device is adjacent the electrical connection area of said first display device, wherein a shortest distance between the first active area and the second active area is less than or equal to ⅛

^th of a pixel pitch.

22. The array of display devices of claim 21, wherein the electrical connection area of the first display device comprises a width, wherein the width is less than 1 millimeter.

23. The array of display devices of claim 21, wherein the electrical connection area is configured to provide electrical communication via wire bonding.

24. The array of display devices of claim 21, wherein the array of display devices comprises at least one interferometric light modulator.

25. The array of display devices of claim 24, wherein the first active area and the second active area each comprise at least one interferometric light modulator.

26. An array of display devices configured to display an image, comprising:

a first display device, comprising;

a package comprising a substrate, a first active area, and means for providing an electrical connection with said first active area;

a sealant ring circumscribing said first active area;

a backplane joined to said sealant ring to form said package, wherein said means for providing an electrical connection with said first active area is electrically connected between said seal and an edge of said substrate; and

a second device comprising a second active area and positioned adjacent said means for providing an electrical connection with said first active area, wherein a shortest distance between the first active area and the second active area is less than or equal to ⅛

^th of a pixel pitch.

27. The array of display devices of claim 26, wherein said first display device further comprises a ledge between said seal and said edge of said substrate, wherein said ledge comprises a width that is less than 1 millimeter.

28. The array of display devices of claim 26, wherein said means for providing an electrical connection with said first active area comprises wire bonding.

29. The array of display devices of claim 26, wherein the array of display devices comprises at least one interferometric light modulator.

30. The array of display devices of claim 29, wherein the first active area and the second active area each comprise at least one interferometric light modulator.

31. A device comprising:

an active area and an electrical connection area, wherein said electrical connection area is configured to provide electrical communication with said active area, wherein the electrical connection area has a width of less than 1 millimeter; and

a sealant ring circumscribing said active area,

wherein the electrical connection area is disposed outside said sealant ring.

32. The device of claim 31, wherein the electrical connection area has a width of less than or equal to 0.5 millimeters.

34. A method of manufacturing a device, comprising:

electrically connecting an active area and an electrical connection area of the device; and

circumscribing a sealant ring around said active area,

wherein the electrical connection area is disposed outside said seal and wherein the electrical connection area has a width of less than 1 millimeter.

35. The method of claim 34, wherein the electrical connection area has a width of less than or equal to 0.5 millimeters.

36. The method of claim 34, wherein the electrical connection area has a width of less than or equal to 0.25 millimeters.