System and method for protecting micro-structure of display array using spacers in gap within display device

• US 20060077147A1
• Filed: 04/15/2005
• Published: 04/13/2006
• Est. Priority Date: 09/27/2004
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Palmateer, Lauren, Chui, Clarence, Cummings, William J., Gally, Brian
• Granted Patent: US 7,573,547 B2
• Time in Patent Office: Days
• US Class Current: 345/85
• CPC Class Codes: B81B 2201/045 Optical switches
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

Physical forces sufficient to deform an electronic device and/or packaging for the electronic device can damage the device. Some mechanical components in a device, for example, in a microelectromechanical device and/or in an interferometric modulator are particularly susceptible to damage. Accordingly, provided herein is a packaging system and packaged electronic device that resists physical damage, a method for manufacturing the same, and a method for protecting an electronic device from physical damage. The packaging system for the electronic device includes one or more spacers that prevent or reduce damage to the electronic device arising from contact with the packaging. In some embodiments, the packaged electronic device comprising spacers is thinner than a comparable device manufactured without spacers.

Claims

1. A display package comprising:

an array of interferometric modulators formed on a substrate;

a backplate;

a seal disposed between the substrate and the backplate, wherein the substrate, backplate, and seal together package the array of interferometric modulators; and

at least one spacer disposed between the array and the backplate, wherein at least one of the spacers prevents the backplate from contacting the array.

2. The display package of claim 1, wherein the substrate is at least partially transparent and/or translucent, and the interferometric modulators are configured to reflect light through the transparent and/or translucent portion of the substrate.

3. The display package of claim 1, wherein the backplate comprises a recessed cap.

4. The display package of claim 1, wherein the backplate comprises a glass backplate.

5. The display package of claim 1, wherein the backplate comprises a desiccant.

6. The display package of claim 1, wherein the seal comprises a hermetic seal.

7. The display package of claim 1, wherein the seal comprises a desiccant.

8. The display package of claim 1, wherein at least one spacer comprises a desiccant.

9. The display package of claim 1, wherein the spacers are regularly spaced.

10. The display package of claim 1, wherein the spacers are irregularly spaced.

11. A method for fabricating a display package comprising:

providing an interferometric modulator array on a substrate;

disposing one or more spacers in the proximity of the interferometric modulator optical array; and

sealing a backplate onto the substrate to form a display package, wherein at least one of the spacers prevents the backplate from contacting the array.

12. The method of claim 11, wherein said substrate is at least partially transparent and/or translucent, and the interferometric modulators are configured to reflect light through the transparent and/or translucent portion of the substrate.

13. The method of claim 11, wherein the backplate comprises a recessed cap.

14. The method of claim 11, wherein the backplate comprises a glass backplate.

15. The method of claim 11, wherein the backplate comprises a desiccant.

16. The method of claim 11, wherein sealing a backplate onto the substrate forms a hermetic seal.

17. The method of claim 11, wherein the at least one of the spacers comprises a desiccant.

18. The method of claim 11, comprising a plurality of regularly spaced spacers.

19. The method of claim 11, comprising a plurality of irregularly spaced spacers.

20. A display package comprising:

an array of interferometric modulators formed on a substrate;

a backplate;

a seal disposed between the substrate and the backplate, wherein the substrate, backplate, and seal together package the array of interferometric modulators; and

a means for preventing the array and the backplate from contacting each other disposed within the display package.

21. The display package of claim 20, wherein the substrate is at least partially transparent and/or translucent, and the interferometric modulators are configured to reflect light through the transparent and/or translucent portion of the substrate.

22. The display package of claim 20, wherein the backplate comprises a recessed cap.

23. The display package of claim 20, wherein the backplate comprises a dessicant.

24. The display package of claim 20, wherein the means comprises a plurality of evenly spaced spacers.

25. The display package of claim 20, wherein the means comprises a plurality of irregularly spaced spacers.

26. A display package manufactured by a process comprising:

providing an interferometric modulator array on a substrate;

disposing one or more spacers in the proximity of the interferometric modulator optical array; and

sealing a backplate onto the substrate to form a display package, wherein at least one of the spacers prevents the backplate from contacting the array.

27. The display package of claim 26, wherein the substrate is at least partially transparent and/or translucent, and the interferometric modulators are configured to reflect light through the transparent and/or translucent portion of the substrate.

28. The display package of claim 26, comprising a plurality of regularly spaced spacers.

29. The display package of claim 26, comprising a plurality of irregularly spaced spacers.