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System and method for providing thermal compensation for an interferometric modulator display

  • US 20060077519A1
  • Filed: 07/22/2005
  • Published: 04/13/2006
  • Est. Priority Date: 09/27/2004
  • Status: Active Grant
First Claim
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1. A system for thermal compensation of a microelectromechanical system (MEMS) device, the system comprising:

  • a substrate characterized by a first thermal expansion coefficient;

    a member coupled to the substrate;

    a movable layer characterized by a second thermal expansion coefficient and coupled to the member; and

    a film located proximate to the substrate and having a third thermal expansion coefficient less than the first thermal expansion coefficient, wherein the film is configured to compensate for expansion of the movable layer with respect to the substrate when the MEMS device is exposed to thermal energy.

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