Method and system for packaging a MEMS device

• US 20060077533A1
• Filed: 01/28/2005
• Published: 04/13/2006
• Est. Priority Date: 09/27/2004
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: IDC, LLC
• Inventors: Palmateer, Lauren, Miles, Mark W., Floyd, Philip D., Sampsell, Jeffrey B., Arbuckle, Brian W.
• Granted Patent: US 7,184,202 B2
• Time in Patent Office: Days
• US Class Current: 359/321
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a backplate and the backplate can contain electronic circuitry for controlling the array of interferometric modulators. The backplate can provide physical support for device components, such as electronic components which can be used to control the state of the display. The backplate can also be utilized as a primary structural support for the device.

Claims

1. A display, comprising:

a transparent substrate;

an array of interferometric modulators configured to reflect light through said transparent substrate;

a backplate sealed to said transparent substrate and providing a cavity for said interferometric modulators; and

electronic circuitry located on said backplate and in electrical connection with the array of interferometric modulators.

2. The display of claim 1, wherein the electronic circuitry is located outside of the cavity formed from the backplate and the transparent substrate.

3. The display of claim 1, wherein the electronic circuitry is located inside of the cavity formed from the backplate and the transparent substrate.

4. The display of claim 1, wherein said interferometric modulator comprises a plurality of internal connectors, and wherein said internal connectors are configured to provide said electrical connection to said electronic circuitry.

5. The display of claim 4, wherein the internal connectors comprise metal bumps

6. The display of claim 4, wherein the internal connectors comprise conductive posts.

7. The display of claim 1, wherein said backplate comprises a printed circuit board.

8. A device having a display, comprising:

a transparent substrate;

an array of interferometric modulators configured to reflect light through said transparent substrate; and

a backplate sealed to said transparent substrate and providing a cavity for said interferometric modulators, wherein said backplate comprises electronic circuitry configured to control said interferometric modulators.

9. The display of claim 8, wherein said electronic circuitry is a display driver circuitry.

10. The device of claim 8, wherein said transparent substrate comprises glass.

11. The device of claim 8, wherein said array of interferometric modulators are configured to reflect multiple colors of light.

12. The device of claim 8, wherein said backplate comprises a printed circuit board.

13. The device of claim 12, wherein said printed circuit board comprises a vapor barrier.

14. The device of claim 8, wherein said backplate is sealed to said transparent substrate by a seal ring.

15. The device of claim 8, wherein the surface area of said backplate is greater than the surface area of said transparent substrate.

16. The device of claim 15, wherein said backplate is configured to function as a primary structural component of the device.

17. The device of claim 16, additionally comprising additional electronic circuitry configured to control the device, wherein said backplate provides physical support for at least some of said additional electronic circuitry.

18. The device of claim 14, wherein said seal ring provides a hermetic seal.

19. The device of claim 8, wherein said device is a cellular telephone.

20. A method of manufacturing a display device, comprising:

providing a transparent substrate comprising an array of interferometric modulators;

providing a backplate comprising electronic circuitry configured to control said array of interferometric modulators;

sealing said transparent substrate to said backplate so that a cavity is formed above said array of interferometric modulators, and wherein said electronic circuitry is placed in electrical communication with said array of interferometric modulators.

21. The method of claim 20, wherein said transparent substrate is glass.

22. The method of claim 20, wherein said transparent substrate is a polymeric material.

23. The method of claim 20, wherein said backplate comprises a driver circuit for controlling said array of interferometric modulators.

24. The method of claim 20, wherein said backplate comprises a printed circuit board.

25. The method of claim 20, wherein sealing said transparent substrate to said backplate comprises placing a sealant material between said transparent substrate and said backplate

26. A display, the process of manufacturing said display comprising:

providing a transparent substrate comprising an array of interferometric modulators;

providing a backplate comprising electronic circuitry configured to control said array of interferometric modulators;

sealing said transparent substrate to said backplate so that a cavity is formed above said array of interferometric modulators, and wherein said electronic circuitry is placed in electrical communication with said array of interferometric modulators.

27. A display, comprising:

means for modulating light and reflecting it towards a viewer;

a first means for supporting said modulating means;

means for controlling the state of said modulation means;

a second means for supporting said controlling means and providing a cavity for said modulating means.

28. The display of claim 27, further comprising means for connecting said controlling means to said modulating means.

29. The display of claim 28, further comprising means for sealing said first supporting means to said second supporting means.

30. A display for an electronic device, comprising:

a first transparent substrate;

a first array of interferometric modulators configured to reflect light through said first transparent substrate and in a first direction;

a backplate sealed to said first transparent substrate and providing a cavity for said first array of interferometric modulators, wherein said backplate comprises electronic circuitry configured to control said first array of interferometric modulators;

a second transparent substrate sealed to said backplate, wherein said second transparent substrate comprises a second array of interferometric modulators configured to reflect light in a second direction, and wherein said first direction and said second direction are opposite directions.

31. The display of claim 30, wherein said backplate comprises electronic circuitry configured to control the states of said first and second arrays of interferometric modulators.

32. The display of claim 30, wherein the surface area of said first transparent substrate is substantially less than the surface area of said second transparent substrate, and wherein said first transparent substrate is attached to said backplate.

33. The display of claim 32, wherein said backplate comprises an annular backplate.

34. The display of claim 33, wherein at least some of said electronic components are located on the same side of the backplate as said first transparent substrate.

35. The display of claim 30, wherein said backplate comprises a printed circuit board.

36. The display of claim 35, additionally comprising a vapor barrier on said backplate.

37. The display of claim 36, additionally comprising a layer of desiccant.

38. The display of claim 30, wherein said first transparent substrate comprises glass.

39. The display of claim 30, wherein said first transparent substrate comprises a polymeric material.

40. A display for an electronic device, comprising:

a first transparent substrate;

a first array of interferometric modulators configured to reflect light through said first transparent substrate and in a first direction;

a backplate sealed to said first transparent substrate and providing a cavity for said first array of interferometric modulators, wherein said backplate comprises electronic circuitry configured to control said first array of interferometric modulators

a second transparent substrate sealed to said first backplane, wherein said second transparent substrate comprises a second array of interferometric modulators configured to reflect light in a second direction, and wherein said first direction and said second direction are opposite directions.

41. The device of claim 40, wherein said first array of interferometric modulators is smaller than said second array of interferometric modulators, and at least some of said electronic circuitry is located within the protective cavity.

42. The display of claim 41, wherein said first transparent substrate comprises glass.

43. The display of claim 41, wherein said first transparent substrate comprises a polymeric material.

44. The display of claim 43, additionally comprising a vapor barrier on said backplate.

45. The display of claim 44, additionally comprising a layer of desiccant.

46. A device having a display, comprising:

a first transparent substrate;

a first array of interferometric modulators configured to reflect light through said first transparent substrate;

a second transparent substrate opposed to said first transparent substrate; and

a second array of interferometric modulators configured to reflect light through said second transparent substrate.

47. The device of claim 46, wherein said first array is smaller than said second array.

48. The device of claim 47, wherein the surface area of said first transparent substrate is less than the surface area of said second transparent substrate.

49. The device of claim 48, additionally comprising an annular carrier, wherein said first transparent substrate is sealed to said annular carrier.

50. A method of manufacturing a display, comprising:

providing a first transparent substrate comprising a first array of interferometric modulators;

providing a second transparent substrate comprising a first array of interferometric modulators;

providing a backplate comprising electronic circuitry configured to control the state of said first and second arrays of interferometric modulators;

sealing said first transparent substrate to said backplate;

sealing said second transparent substrate to said backplate; and

placing said electronic circuitry in electrical connection with said first and second arrays of interferometric modulators.

51. The method of claim 50, wherein said first transparent substrate comprises glass.

52. The method of claim 50, wherein said first transparent substrate comprises a polymeric material.

53. The method of claim 50, wherein said backplate comprises a printed circuit board.

54. A display, the process of manufacturing said display comprising:

providing a first transparent substrate comprising a first array of interferometric modulators;

providing a second transparent substrate comprising a first array of interferometric modulators;

providing a backplate comprising electronic circuitry configured to control the state of said first and second arrays of interferometric modulators;

sealing said first transparent substrate to said backplate;

sealing said second transparent substrate to said backplate; and

placing said electronic circuitry in electrical connection with said first and second arrays of interferometric modulators.

55. A display, said display comprising

a first means for modulating light and reflecting it towards a viewer;

a first means for supporting said first modulating means;

a second means for modulating light and reflecting it towards a viewer;

a second means for supporting said second modulating means

means for controlling the state of said first and second modulation means; and

a third means for supporting said controlling means.

56. The display of claim 55, further comprising means for connecting said controlling means to said first and second modulating means.

57. The display of claim 56, further comprising:

means for sealing said first supporting means to said third supporting means; and

means for sealing said second supporting means to said third supporting means.

58. A micro-electro-mechanical (MEM) device comprising:

a substrate comprising a plurality of MEM elements;

a backplate comprising a shaped region and a substantially planer perimeter region, wherein said backplate comprises a plurality of conductive paths that provide electrical connectivity to the MEM elements; and

at least one electrical component electronically coupled to at least one of the conductive paths.

59. The device of claim 58 wherein the backplate comprises a backside facing the exterior of the device, and wherein the conductive paths are conductive busses disposed on said backside.

60. The device of claim 59 further comprising conductive vias that traverse the backplate, and wherein the conductive busses are in electrical communication with the MEM elements through the vias.

61. The device of claim 60 wherein at least a portion of the MEM elements are disposed underneath the shaped region of the backplate.