Control device and method of manufacturing thereof

• US 20060077643A1
• Filed: 10/05/2005
• Published: 04/13/2006
• Est. Priority Date: 10/06/2004
• Status: Active Grant

• Current Assignee: Hitachi Astemo Ltd. (Hitachi, Ltd.)
• Original Assignee: Hitachi, Ltd.
• Inventors: Sasaki, Masahiro, Mayuzumi, Takuya, Eguchi, Shuji, Kadoya, Kiyoomi
• Granted Patent: US 7,359,212 B2
• Time in Patent Office: Days
• US Class Current: 361/753
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 2201/09054 Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/2036 Permanent spacer or stand-off in a printed circuit or printed circuit assembly pattern for applying drops or paste H05K2203/0545
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 5/0034 having an overmolded housing covering the PCB
• CPC Class Codes: H05K 5/0082 specially adapted for transmission control units, e.g. gearbox controllers
• CPC Class Codes: H05K 7/20854 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

A module comprises a metallic terminal pins for connection and a circuit board with electronic components mounted thereon, a circuit board connecting side of the connector. The electronic components and the circuit board with the electronic components mounted thereon are encapsulated with the same resin. A metallic base is united to the module to obtain an electric conduction between the metallic base and the circuit board.

Claims

1. A control device comprising:

plural electronic components for forming a control circuit;

connector pins for connecting electrically the control circuit to external equipment;

a circuit board with the connector pins and the plural electronic components installed thereon; and

a metallic member on which the circuit board is mounted, and connected electrically to the circuit board,

wherein the plural electronic components, the circuit board and a part of the connector pins are encapsulated in a resin molding compound.

2. The control device according to claim 1, further comprising solder applied to the circuit board and encapsulated in the resin molding compound together in the plural electronic components, the circuit board and the connector pins,

wherein the circuit board and the metallic member are electrically connected with each other through the solder.

3. The control device according to claim 1, further comprising a metallic spacer fixed to the circuit board and encapsulated with the resin molding compound together in the plural electronic components, the circuit board and the connector pins,

wherein the circuit board and the metallic member are electrically connected with each other through the metallic spacer.

4. The control device according to claim 3, wherein the metallic spacer is provided with a convex or concave portion.

5. The control device according to claim 3, wherein the metallic spacer and the metallic member are fixed together using a screw, and the circuit board and the metallic member are electrically connected with each other through the screw.

6. The control device according to claim 1, the circuit board and the metallic member are electrically bonded with each other through a conductive adhesive.

7. A control device comprising:

plural electronic components for forming a control circuit;

connector pins for connecting electrically the control circuit to external equipment;

a circuit board with the connector pins and the plural electronic components installed thereon; and

a metallic member on which the circuit board is mounted, and connected electrically to the circuit board,

wherein the plural electronic components, the circuit board and a part of the connector pins are encapsulated in a resin molding compound, and at least partial region of the resin molding compound are sandwiched by the metallic member.

8. The control device according to claim 7, wherein the metallic member is electrically connected to the circuit board in at least two positions.

9. The control device according to claim 7, the circuit board and the metallic member are electrically connected with each other in the sandwiched partial regions of the resin molding compound.

10. The control device according to claim 7, wherein, a thermal expansion coefficient of the resin molding compound is smaller than that of the metallic member.

11. The control device according to claim 7, further comprising solder applied to the circuit board and encapsulated in the resin molding compound together in the plural electronic components, the circuit board and the connector pins,

wherein the circuit board and the metallic member are electrically connected with each other through the solder.

12. The control device according to claim 7, further comprising a metallic spacer fixed to the circuit board and encapsulated with the resin molding compound together in the plural electronic components, the circuit board and the connector pins,

wherein the circuit board and the metallic member are electrically connected with each other through the metallic spacer.

13. The control device according to claim 12, wherein the metallic spacer is provided with a convex or concave portion

14. The control device according to claim 12, wherein the metallic spacer and the metallic member are fixed together using a screw, and the circuit board and the metallic member are electrically connected with each other through the screw.

15. The control device according to claim 7, the circuit board and the metallic member are electrically bonded with each other through a conductive adhesive.

16. A method of manufacturing a control device, comprising the steps of:

connecting plural electronic components and connector pins for external connection with a wiring-formed circuit board to form a control circuit;

encapsulating the plural electronic components, the circuit board and a part of the connector pins with a resin molding compound, and

connecting the control circuit and the metallic member for mounting the control circuit electrically with each other.

17. The method according to claim 16, wherein, after connecting the control circuit and the metallic member, the resin molding compound including the electronic components and the circuit board is fixed to the metallic member so that at least partial region of the resin molding compound are sandwiched by the metallic member.

18. The method according to claim 16, wherein solder, a spacer, or springs are encapsulated together with the electronic components, the circuit board and the connector pins in the resin molding compound, and the control circuit and the metallic member are electrically connected with each other through the solder, spacer, or springs.

19. The method according to claim 16, wherein the control circuit and the metallic member are electrically connected with each other in two or more positions.