Manufacturing method for a semiconductor device
First Claim
1. A manufacturing method for a semiconductor device having a thin film transistor comprising:
- forming an amorphous semiconductor film on an insulating surface; and
irradiating a laser light to perform crystallization to a region in which active layers of the thin film transistor is formed, wherein the laser light is a laser light of pulse oscillation having a repetition frequency of several MHz, and wherein a direction in which the laser light is moved on the amorphous semiconductor film is parallel to a direction in which carriers move in a channel formation region in the thin film transistor.
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Abstract
Position control of a crystal grain in accordance with an arrangement of a TFT is achieved, and at the same time, a processing speed during a crystallization process is increased. More specifically, there is provided a manufacturing method for a semiconductor device, in which crystal having a large grain size can be continuously formed through super lateral growth that is artificially controlled and substrate processing efficiency during a laser crystallization process can be increased. In the manufacturing method for a semiconductor device, instead of performing laser irradiation on an entire semiconductor film within a substrate surface, a marker as a reference for positioning is formed so as to crystallize at least an indispensable portion at minimum. Thus, a time period required for laser crystallization can be reduced to make it possible to increase a processing speed for a substrate. The above structure is applied to a conventional SLS method, so that it is possible to solve a problem inherent to the conventional SLS method, in that the substrate processing efficiency is poor.
106 Citations
19 Claims
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1. A manufacturing method for a semiconductor device having a thin film transistor comprising:
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forming an amorphous semiconductor film on an insulating surface; and
irradiating a laser light to perform crystallization to a region in which active layers of the thin film transistor is formed, wherein the laser light is a laser light of pulse oscillation having a repetition frequency of several MHz, and wherein a direction in which the laser light is moved on the amorphous semiconductor film is parallel to a direction in which carriers move in a channel formation region in the thin film transistor. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A manufacturing method for a semiconductor device having a thin film transistor comprising:
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forming an amorphous semiconductor film on an insulating surface;
forming a marker on the amorphous semiconductor film; and
selectively irradiating the laser light to perform crystallization to a region in which an active layer of the thin film transistor is formed, based on information on arrangement of the thin film transistor with the marker used as a reference, wherein the laser light is a laser light of pulse oscillation having a repetition frequency of several MHz, and wherein a direction in which the laser light is moved on the amorphous semiconductor film is parallel to a direction in which carriers move in a channel formation region in the thin film transistor. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A manufacturing method for a semiconductor device having a thin film transistor comprising:
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forming an amorphous semiconductor film on an insulating surface; and
irradiating a laser light to perform crystallization to a region in which active layers of the thin film transistor is formed, wherein the laser light is a laser light of pulse oscillation having a repetition frequency of several MHz and emitted from a solid laser oscillation apparatus, and wherein a direction in which the laser light is moved on the amorphous semiconductor film is parallel to a direction in which carriers move in a channel formation region in the thin film transistor. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification