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Method for depositing nanolaminate thin films on sensitive surfaces

  • US 20060079090A1
  • Filed: 11/28/2005
  • Published: 04/13/2006
  • Est. Priority Date: 10/15/1999
  • Status: Active Grant
First Claim
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1. An atomic layer deposition (ALD) process for growing a carbon-containing metallic film on a substrate in a reaction space comprising the sequential steps of:

  • a) feeding a vapor-phase pulse of a metal source chemical into the reaction space with an inert carrier gas;

    b) purging the reaction space with an inert gas;

    c) feeding a vapor-phase pulse of a gettering compound into the reaction space;

    d) purging the reaction space with an inert gas; and

    e) repeating steps a) through d) until the carbon-containing metal film of a desired thickness is formed;

    wherein the gettering compound comprises carbon and leaves carbon in the film.

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