Method and system for sealing a substrate
First Claim
1. A method of sealing a microelectromechanical system (MEMS) device from ambient conditions, comprising:
- forming a substantially metal seal on a substrate comprising a MEMS device; and
attaching a backplane to said metal seal so as to seal said MEMS device from ambient conditions.
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Accused Products
Abstract
A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described, wherein the MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method comprises forming a metal seal on the substrate proximate a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.
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Citations
35 Claims
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1. A method of sealing a microelectromechanical system (MEMS) device from ambient conditions, comprising:
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forming a substantially metal seal on a substrate comprising a MEMS device; and
attaching a backplane to said metal seal so as to seal said MEMS device from ambient conditions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of packaging a microelectromechanical system (MEMS) device, comprising:
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depositing an insulator over a MEMS device formed on a substrate, wherein the MEMS device includes a sacrificial layer;
depositing one or more metal layers over the insulator;
forming a mask with one or more cavities over the metal layer;
forming one or more metal seal layers in the one or more cavities, thereby forming a substantially hermetic seal proximate a perimeter of the MEMS device;
removing the mask layer, the one or more metal layers, and the insulating layer;
removing the sacrificial layer from the MEMS device; and
positioning a backplane in contact with the seal so as to seal the MEMS device from ambient conditions. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A system for sealing a microelectromechanical system (MEMS) device from ambient conditions, comprising:
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a MEMS device formed on a substrate;
means for providing a substantially metal seal on said substrate and proximate a perimeter of said MEMS device, thereby forming a substantially hermetic seal proximate a perimeter of the MEMS device; and
a backplane in contact with the substantially metal seal, thereby encapsulating the MEMS device within the substrate, the substantially metal seal, and the backplane. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34)
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35. A microelectromechanical system (MEMS) device sealed from ambient conditions, comprising:
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a MEMS device formed on a substrate;
a substantially metal seal formed on the substrate proximate a perimeter of the MEMS device; and
a backplane in contact with the substantially metal seal, thereby encapsulating the MEMS device within the substrate, the substantially metal seal, and the backplane.
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Specification