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Systems and methods for magnetron deposition

  • US 20060081467A1
  • Filed: 10/15/2004
  • Published: 04/20/2006
  • Est. Priority Date: 10/15/2004
  • Status: Abandoned Application
First Claim
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1. A face target sputtering apparatus to fabricate semiconductors, comprising:

  • an air-tight chamber in which an inert gas is admittable and exhaustible;

    a first cylindrical target plate in the chamber;

    inner and outer cylindrical magnets respectively disposed adjacent to the cylindrical target plate such that magnet poles of different polarities face each other across said plasma region thereby to establish a magnetic field covering the target plate; and

    a substrate holder adapted to hold a substrate on which an alloyed thin film is to be deposited.

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