SIGNAL TRANSFER METHODS FOR INTEGRATED CIRCUITS

• US 20060081971A1
• Filed: 10/23/2005
• Published: 04/20/2006
• Est. Priority Date: 09/30/1997
• Status: Abandoned Application

• Current Assignee: Jeng Jye Shau
• Original Assignee: Jeng Jye Shau
• Inventors: Shau, Jeng Jye
• Application Number:
  US11/163,564
• Publication Number:
  US 20060081971A1
• Time in Patent Office: Days
• US Class Current: 257/690
• CPC Class Codes: G01R 31/2831 Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates G01R31/318511 takes precedence; testing during manufacture H01L22/00
• CPC Class Codes: G01R 31/2856 Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/318505 Test of Modular systems, e.g. Wafers, MCM's
• CPC Class Codes: G01R 31/318511 Wafer Test
• CPC Class Codes: H01L 22/32 Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors arrangements for conducting electric current to or from the solid state body in operation H01L23/48
• CPC Class Codes: H01L 2223/5448 Located on chip prior to dicing and remaining on chip after dicing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

The present invention discloses novel methods to transfer data between a plurality of integrated circuit blocks on a semiconductor wafer. Each individual circuit blocks contains internal circuits to control data transfer to nearby circuit blocks. Long distance signal transfer is achieved by a series of short distance data transfers. Such signal transfer methods provide many possible paths to transfer data between two points, allowing the possibility to bypass defective circuits. The present invention allows the possibility to integrate large amount of circuits into a single IC product while achieving excellent yield.

Claims

1. A method for signal transfers between a plurality of integrated circuit blocks on the same semiconductor substrate, the method comprising the steps of:

(a) forming signal transfer paths between and only between nearby integrated circuit blocks on the same semiconductor substrate, (b) providing control circuits to control signal transfers using said signal transfer paths between nearby integrated circuit blocks where said control circuits allow multiple direction signal transfers from a integrated circuit block to a plurality of nearby integrated circuit blocks, and allow transfers between far away integrated circuit blocks through paths comprising a series of said signal transfer paths between nearby integrated circuit blocks, (c) forming a web network of signal transfer paths between a plurality of integrated circuit blocks using said signal transfer paths between nearby circuit blocks where multiple signal transfer paths are available for signal transfers between two points in the integrated circuits on the same wafer.

2. A signal transfer network for signal transfers between a plurality of integrated circuit blocks on the same semiconductor substrate, said signal transfer network comprises a plurality of signal transfer paths between and only between nearby integrated circuit blocks on the same semiconductor substrate, and control circuits controlling multiple direction signal transfers from a integrated circuit block to a plurality of nearby integrated circuit blocks, wherein said signal transfer paths between nearby integrated circuit blocks forming a web network, and provide multiple signal transfer paths available for signal transfers between two points in the integrated circuits on the same wafer.