Assembly

• US 20060081994A1
• Filed: 01/18/2005
• Published: 04/20/2006
• Est. Priority Date: 10/19/2004
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Chen, Chien-Hua, Haluzak, Charles C., Craig, David M., Yenchik, Ronnie J.
• Granted Patent: US 7,262,498 B2
• Time in Patent Office: Days
• US Class Current: 257/772
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An assembly includes a substrate, a device coupled to the substrate; a ring formed on the substrate; and one or more bonding pads formed on the substrate, wherein the ring and bonding pads are formed of a same material.

Claims

1. An assembly, comprising:

a substrate;

a device coupled to said substrate;

a ring formed on said substrate; and

one or more bonding pads formed on said substrate, wherein said ring and bonding pads are formed of a same material.

2. The assembly of claim 1, wherein said material comprises solder.

3. The assembly of claim 2, wherein said material comprises AuSn solder.

4. The assembly of claim 3, wherein said AuSn solder comprises 80 Au/20 Sn eutectic solder.

5. The assembly of claim 1, and further comprising a cover hermetically sealed to said substrate by said ring.

6. The assembly of claim 5, wherein said cover comprises a glass lid.

7. The assembly of claim 1, and further comprising one or more leads extending between said micro-electromechanical device and said bonding pads.

8. The assembly of claim 7, wherein at least one of said one or more leads comprise aluminum wires having titanium deposited on at least a portion thereof.

9. An electronic device, comprising:

an substrate having bonding pads and a ring formed of substantially the same material;

a circuit having circuit leads coupled to said bonding pads; and

a controller coupled to said circuit.

10. The device of claim 9, wherein said circuit comprises a tape-automated bond circuit.

11. The device of claim 9, wherein said bonding pads and said ring are on a single side of said substrate.

12. The device of claim 9, wherein said bonding pads comprise solder.

13. A method, comprising:

forming a ring on a substrate;

forming one or more bonding pads on said substrate;

wherein the ring and the bonding pads are formed a same material.

14. The method of claim 13, and wherein said steps of forming said ring and said bonding pads occur at substantially the same time.

15. The method of claim 13, and further comprising coupling a cover to said ring.

16. The method of claim 15, wherein coupling said cover to said ring comprises applying heat.

17. The method of claim 13, wherein forming said ring and bonding pads comprises forming solder patterns.

18. The method of claim 17, wherein forming said solder patterns comprises forming AuSn solder pads.

19. The method of claim 18, wherein forming said AuSn solder pads comprises forming 80 Au/20 Sn eutectic solder pads.

20. The method of claim 13, and further comprising coupling circuit leads to said bonding pads.

21. The method of claim 20, wherein coupling said circuit leads to said bonding pads comprises thermocompression bonding.

22. A system, comprising:

means for sealing;

means for bonding leads;

the means for sealing and the means for boding leads formed of a same material.

23. The system of claim 22, wherein the same material is solder.

24. The system of claim 22, wherein the means for sealing and the means for bonding are at a same side of a substrate.

25. The system of claim 22, and further comprising a semiconductor device disposed within the ring.

26. The system of claim 22, and further comprising a cover disposed on the ring.

27. The system of claim 22, and further comprising circuit means for providing an electrical signal to said micro-electromechanical device.

28. An electronic device, comprising:

a controller;

a circuit coupled to said controller; and

an assembly coupled to the circuit, the assembly including a substrate, a ring and one or more bonding pads formed on said substrate, wherein said ring and bonding pads are formed of a same material.