Acceleration sensor

• US 20060086185A1
• Filed: 04/14/2005
• Published: 04/27/2006
• Est. Priority Date: 10/26/2004
• Status: Abandoned Application

• Current Assignee: Fujitsu Limited, Fujitsu Media Devices Limited (Fujitsu Limited)
• Original Assignee: Fujitsu Limited, Fujitsu Media Devices Limited (Fujitsu Limited)
• Inventors: Nagata, Kenji, Tanaka, Hiroshi, Ono, Masaaki, Ishikawa, Hiroshi, Miyashita, Tsutomu, Yamada, Sumio, Ono, Nobuko
• Application Number:
  US11/105,586
• Publication Number:
  US 20060086185A1
• Time in Patent Office: Days
• US Class Current: 73/514.160
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 3/0072 For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: G01D 11/30 Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0842 the mass being of clover leaf shape

Abstract

An acceleration sensor with reduced noise that resolves the problem of stress arising from a difference in thermal expansion coefficients is provided. The acceleration sensor detects acceleration in three-axis directions in a three-dimensional coordinate system, and includes a frame having four sides that is integrally formed by a semiconductor substrate; a weight portion that is positioned within the frame; and four beam portions, corresponding with each of the four sides, one end of which is connected to the weight portion to support the weight portion and the other end of which is connected to the center of the corresponding side of the four sides, wherein a detection element that detects flexure of the beam portions that corresponds to the acceleration acting on the weight portion is formed on each of the four beam portions; a pair of joint portions that are formed with a gap there between are formed on each of the four sides of the frame; and the gap between the pair of joint portions formed on one side has a predetermined length with the center of the one side as the point of symmetry.

Claims

1. An acceleration sensor that detects acceleration in three-axis directions in a three-dimensional coordinate system, comprising:

a frame having four sides that is integrally formed by a semiconductor substrate;

a weight portion that is positioned within the frame;

four beam portions, corresponding with each of the four sides, one end of which is connected to the weight portion to support the weight portion and the other end of which is connected to the center of the corresponding side of the four sides;

detection elements, each of which is formed on each of the four beam portions and detects flexure of the beam portions that corresponds to the acceleration acting on the weight portion; and

a pair of joint portions that are formed with a gap there between are formed on each of the four sides of the frame,

the gap between the pair of joint portions formed on one side having a predetermined length with the center of the one side as the point of symmetry.

2. The acceleration sensor according to claim 1, wherein each of the pair of joint portions comprises a plurality of electrode terminals connected to an electrode lead that is linked to the detection element, and the plurality of electrode elements are disposed at equal intervals along the corresponding side.

3. The acceleration sensor according to claim 1 or 2, wherein the offset voltage that is detected by the detection element is adjusted by means of The size of the gap between the pair of joint portions.

4. The acceleration sensor according to claim 1, wherein the frame has a predetermined thickness and comprises, on each of the four sides thereof, a recess, in which a region that is narrower than the predetermined thickness is formed uniformly to a predetermined length along the side of the frame on the opposite side from the face where the pair of joint portions is formed;

and

the recess, which is joined to a mount opposite the opposite side, forms a space groove that is between the substrate and the frame.

5. The acceleration sensor according to claim 1, wherein the frame has a predetermined thickness and is formed by means of a recess in which at least a region where the pair of joint portions is formed uniformly to a predetermined length that is narrower than the predetermined thickness along a side of the frame;

and

the recess, which is joined to a stopper substrate opposite the pair of joint portions, forms a space groove that is between the stopper substrate and the frame.

6. The acceleration sensor according to claim 4, wherein the mount that is joined to the frame is a circuit substrate, a package bottom portion or a package cover.

7. The acceleration sensor according to claim 4 or 5, wherein the offset voltage that is detected by the detection element is adjusted by means of the predetermined length of the recess.

8. The acceleration sensor according to claim 4 or 5, wherein a groove portion is also formed in the reverse side of the frame in a direction that matches the vertical direction of the space grooves, in the center of the recess of the frame.

9. The acceleration sensor according to claim 4 or 5, wherein groove portions are formed in positions corresponding with the four corners of the frame on the surface side of the frame.