Acceleration sensor chip package and method of producing the same

• US 20060086186A1
• Filed: 10/20/2005
• Published: 04/27/2006
• Est. Priority Date: 10/22/2004
• Status: Active Grant

• Current Assignee: LAPIS Semiconductor Co., Ltd. (ROHM Co., Ltd.)
• Original Assignee: OKI Electric Industry Company Limited
• Inventors: Ichikawa, Shunji
• Granted Patent: US 7,334,476 B2
• Time in Patent Office: Days
• US Class Current: 73/514.360
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

An acceleration sensor chip package includes an acceleration sensor chip; a sensor control chip; a re-wiring layer; an outer terminal; a sealing portion; and a substrate. The acceleration sensor chip includes a frame portion; a movable structure; a detection element; and an electrode pad electrically. The re-wring layer has a wiring portion connected to the electrode pad. The electrode pad is electrically connected to a conductive bump. The sensor control chip has a sensor control electrode pad electrically connected to the conductive bump. The outer terminal is connected to the wiring portion and disposed in the outer region. The sealing portion seals the sensor control chip, the electrode pad, and the re-wiring layer, so that the movable structure is movable. The substrate is attached to the acceleration sensor chip to seal an opening portion.

Claims

1. An acceleration sensor chip package, comprising:

an acceleration sensor chip including a frame portion having an upper surface, a lower surface opposite to the upper surface, an inner region, and an outer region surrounding the inner region, an opening portion formed in the inner region and extending from the upper surface to the lower surface, a movable structure having a beam portion extending from the frame portion toward inside the opening portion and a movable portion disposed in the opening portion and supported on the beam portion to be movable, a detection element for detecting a movement of the movable structure, and an electrode pad electrically connected to the detection element and disposed in the outer region;

a re-wring layer disposed on the outer region and including a wiring portion with two ends, one of said two ends being electrically connected to the electrode pad;

an outer terminal disposed on the outer region and electrically connected to the other of the two ends of the wiring portion;

a conductive bump electrically connected to the electrode pad;

a sensor control chip having a first surface, a second surface opposite to the first surface, and a sensor control electrode pad exposed from the first surface and electrically connected to the conductive bump;

a sealing portion disposed on the outer region for sealing the sensor control chip, the electrode pad, and the re-wiring layer so that the outer terminal is exposed and the movable structure is capable of operating; and

a substrate attached to the lower surface for sealing the opening portion from below.

2. The acceleration sensor chip package according to claim 1, wherein said electrode pad includes a first electrode pad connected to the detection element and a second electrode pad, said re-wiring layer including a first wiring portion having one end connected to the electrode pad and the other end connected to the outer terminal, and a second wiring portion having one end connected to the second electrode pad and the other end connected to the outer terminal.

3. The acceleration sensor chip package according to claim 1, wherein said outer terminal includes an electrode post having a top surface exposed from the sealing portion and connected to the other of the two ends of the wiring portion, and a solder ball disposed on and electrically connected to the top surface.

4. The acceleration sensor chip package according to claim 1, further comprising a resin ring portion with a closed shape surrounding the opening portion and closely contacting with the frame portion and the first surface of the sensor control chip.

5. The acceleration sensor chip package according to claim 4, wherein said resin ring portion is disposed to fill a gap of the conductive bump.

6. An acceleration sensor chip package, comprising:

an acceleration sensor chip including a frame portion having an upper surface, a lower surface opposite to the upper surface, an inner region, and an outer region surrounding the inner region, an opening portion formed in the inner region and extending from the upper surface to the lower surface, a movable structure having a beam portion extending from the frame portion toward inside the opening portion and a movable portion disposed in the opening portion and supported on the beam portion to be movable, a detection element for detecting a movement of the movable structure, and an electrode pad electrically connected to the detection element and disposed in the outer region;

a sensor control chip having a first surface, a second surface opposite to the first surface, and a sensor control electrode pad disposed from the first surface, said second surface being attached to the lower surface of the frame portion;

an upper wiring portion extending on the outer region and having one end connected to the electrode pad;

a groove portion having a first groove portion and a second groove portion disposed in a side surface of the sensor control chip, said first groove portion extending from the upper surface to the lower surface of the frame portion, said second groove portion connected to the first groove portion and extending from the first surface to the second surface of the sensor control chip;

a side wiring portion disposed in the groove portion and having a first end and a second end, said first end being electrically connected to the other end of the upper wiring portion;

a lower wiring portion extending on the first surface of the sensor control chip and having one end connected to the second end of the side wiring portion;

a re-wring portion extending on the first surface of the sensor control chip and having one end connected to the electrode pad;

an outer terminal disposed on the first surface of the sensor control chip and connected to at least one of the other end of the lower wiring portion and the other end of the re-wiring portion;

a sealing portion for sealing the sensor control chip such that the outer terminal is exposed; and

a substrate having a recess portion for covering the movable structure and attached to the lower surface of the acceleration sensor chip such that the recess portion is situated above the movable structure.

7. The acceleration sensor chip package according to claim 6, wherein said side wiring portion is arranged such that the side wiring portion is exposed from a side surface of the frame portion.

8. A method of producing an acceleration sensor chip package, comprising the steps of:

preparing a semiconductor substrate having a plurality of acceleration sensors arranged in a matrix pattern, each of said acceleration sensors having an electrode pad and a movable structure disposed in an opening portion;

attaching a substrate to a lower surface of the semiconductor substrate;

forming a re-wiring layer extending on the semiconductor substrate outside the opening portions and having a plurality of wiring portions, each of said wiring portions having one end electrically connected to each of the electrode pads;

forming a plurality of outer terminals on the semiconductor substrate outside the opening portions, each of said outer terminals being connected to the other end of each of the wiring portions;

forming a plurality of conductive bumps connected to the electrode pads;

attaching a sensor control chip having a first surface and a second surface opposite to the first surface, said sensor control chip having sensor control electrode pads connected to the electrode pads;

forming a sealing portion for sealing the sensor control chip, the electrode pads, and the re-wiring layer such that the outer terminals are exposed; and

cutting the sealing portion, the semiconductor substrate, and the substrate situated between the acceleration sensors to obtain the acceleration sensor chip package as a piece.

9. The method of producing an acceleration sensor chip package according to claim 8, further comprising the step of forming a resin ring portion surrounding the opening portions and closely contacting with the first surface of the sensor control chip.

10. A method of producing an acceleration sensor chip package, comprising the steps of:

preparing a semiconductor substrate having a plurality of acceleration sensors arranged in a matrix pattern in areas defined by scribe lines extending between the acceleration sensors and a plurality of chip through holes arranged on the scribe lines, each of said acceleration sensors having an electrode pad and a movable structure disposed in an opening portion;

attaching a first substrate having a plurality of sensor control chips arranged in a matrix pattern to the semiconductor substrate, each of said sensor control chips including a first surface and a second surface opposite to the first surface so that the second surface is attached to a lower surface of the semiconductor substrate, each of said sensor control chips including a plurality of sensor control electrode pads exposed from the first surface to face the electrode pads, each of said sensor control chips including a plurality of control chip through holes to communicate with the chip through holes;

filling the control chip through holes and the chip through holes with a conductive material to form side wiring portions each having a first end and a second end;

forming upper wiring portions in regions between the scribe lines and the opening portion, each of said upper wiring portions having one end connected to each of the electrode pads and the other end connected to the first end of each of the side wiring portions;

attaching a second substrate having a plurality of recess portions to the semiconductor substrate such that the recess portions are situated above the movable structures and cover the same;

forming lower wiring portions extending on the first surfaces of the sensor control chips, each of said lower wiring portions having one end connected to the second end of each of the side wiring portions;

forming outer terminals on the first surfaces of the sensor control chips, each of the outer terminals being connected to the other end of each of the lower wiring portions;

forming a sealing portion for sealing the sensor control chips such that the outer terminals are exposed;

cutting the sealing portion, the semiconductor substrate, and the second substrate into pieces along the scribe lines between the acceleration sensors; and

cutting the side wiring portions to be exposed from side surfaces.

11. The method of producing an acceleration sensor chip package according to claim 10, further comprising the step of forming the control chip through holes and the chip through holes such that each of the control chip through holes and the chip through holes has a oval section taken along an extending direction thereof, said oval section having a long axis extending in a direction perpendicular to at least one of the scribe lines.