Processing gas supply mechanism, film forming apparatus and method, and computer storage medium storing program for controlling same

• US 20060086319A1
• Filed: 12/09/2005
• Published: 04/27/2006
• Est. Priority Date: 06/10/2003
• Status: Abandoned Application

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Kasai, Shigeru, Yamamoto, Norihiko
• Application Number:
  US11/297,394
• Publication Number:
  US 20060086319A1
• Time in Patent Office: Days
• US Class Current: 118/715
• CPC Class Codes: C23C 16/16 from metal carbonyl compounds
• CPC Class Codes: C23C 16/45565 Shower nozzles
• CPC Class Codes: C23C 16/4557 Heated nozzles

Abstract

A processing gas supply mechanism installed on a processing chamber of a film forming apparatus for supplying a processing gas containing a metal organic compound onto a substrate to be processed includes a processing gas inlet opening for introducing the processing gas, a diffusion space for diffusing the processing gas introduced from the processing gas inlet opening, a processing gas supply mechanism main body for forming the processing gas diffusion space, and one or more processing gas supply holes for supplying the processing gas from the diffusion space to a processing space on the substrate in the processing chamber. Further, the processing gas supply holes are shaped to have a Peclet number of 0.5 to 2.5 when the processing gas passes therethrough.

Claims

1. A processing gas supply mechanism, installed on a processing chamber of a film forming apparatus, for supplying a processing gas containing a metal organic compound gas onto a substrate to be processed loaded on a substrate supporting table disposed in the processing chamber, comprising:

a processing gas inlet opening for introducing the processing gas;

a diffusion space for diffusing the processing gas introduced from the processing gas inlet opening;

a processing gas supply mechanism main body for forming the processing gas diffusion space; and

one or more processing gas supply holes for supplying the processing gas from the diffusion space to a processing space on the substrate to be processed in the processing chamber,

wherein the processing gas supply holes are shaped to have a Peclet number of 0.5 to 2.5 when the processing gas passes therethrough.

2. The processing gas supply mechanism of claim 1, wherein the metal organic compound is W(CO)₆.

3. The processing gas supply mechanism of claim 1, wherein the processing gas contains a carrier gas composed of an inert gas.

4. The processing gas supply mechanism of claim 1, wherein the processing gas supply mechanism main body has a shower plate placed approximately in parallel to the substrate to be processed;

and the number of the processing gas supply holes is greater than one, and the processing gas supply holes are formed on the shower plate.

5. The processing gas supply mechanism of claim 1, wherein the diffusion space includes therein a diffusion member for changing a flow direction of the processing gas introduced from the processing gas inlet opening to thereby diffuse the processing gas into the diffusion space.

6. The processing gas supply mechanism of claim 1, wherein the processing gas supply mechanism main body has a heating mechanism.

7. The processing gas supply mechanism of claim 6, wherein the heating mechanism is a flow channel formed in the processing gas supply mechanism main body and has a structure to allow a heated heat exchange medium to flow through the flow channel.

8. A film forming apparatus comprising:

a processing chamber;

a substrate supporting table, disposed in the processing chamber, for supporting a substrate to be processed;

an exhaust port for evacuating the processing chamber; and

a processing gas supply mechanism, disposed on the processing chamber, for supplying a processing gas containing a metal organic compound onto the substrate to be processed,

wherein the processing gas supply mechanism includes;

a processing gas inlet opening for introducing the processing gas;

a diffusion space for diffusing the processing gas introduced from the processing gas inlet opening;

a processing gas supply mechanism main body for forming the diffusion space; and

one or more processing gas supply holes for supplying the processing gas from the diffusion space to a processing space on the substrate to be processed in the processing chamber,

wherein the processing gas supply holes are shaped to have a Peclet number of 0.5 to 2.5 when the processing gas passes therethrough.

9. The film forming apparatus of claim 8, wherein the metal organic compound is selected from the group consisting of W(CO)₆, Ni(CO)₄, Mo(CO)₆, Ru₃(CO)₁₂, CO₂ (CO)₈, Rh₄(CO)₁₂, Re₂(CO)₁₂, Hf(OtBu)₄, Ru(Cp)₂, TBTDET, TAIMATA, TMA, Pb(DRM)₂, Zr(O-i-Pr) (DPM)₂ and Ti (O-i-Pr) 2 (DPM)₂.

10. The film forming apparatus of claim 8, the processing gas contains a carrier gas composed of an inert gas.

11. The film forming apparatus of claim 8, the processing gas supply mechanism main body has a shower plate placed approximately in parallel to the substrate to be processed;

and the number of the processing gas supply holes is greater than one, and the processing gas supply holes are formed on the shower plate.

12. The film forming apparatus of claim 8, wherein the diffusion space includes therein a diffusion member for changing a flow direction of the processing gas introduced from the processing gas inlet opening to thereby diffuse the processing gas into the diffusion space.

13. The film forming apparatus of claim 8, wherein the processing gas supply mechanism main body has a heating mechanism.

14. The film forming apparatus of claim 13, wherein the heating mechanism is a flow channel formed in the processing gas supply mechanism main body and has a structure to allow a heated heat exchange medium to flow through the flow channel.

15. The film forming apparatus of claim 8, wherein a source supply unit for generating the processing gas by vaporizing a source material and supplying the processing gas into the processing gas supply mechanism is connected thereto via a connecting pipe, and an inner diameter of the connecting pipe ranges from 15 mm to 100 mm.

16. A method for forming a film on a substrate to be processed by using a film forming apparatus, the film forming apparatus including:

a processing chamber;

a substrate supporting table, disposed in the processing chamber, for supporting a substrate to be processed;

an exhaust port for evacuating the processing chamber; and

a processing gas supply mechanism, disposed on the processing chamber, for supplying a processing gas containing a metal organic compound onto the substrate to be processed,

wherein the processing gas supply mechanism includes;

a processing gas inlet opening for introducing the processing gas;

a diffusion space for diffusing the processing gas introduced from the processing gas inlet opening;

a processing gas supply mechanism main body for forming the diffusion space; and

one or more processing gas supply holes for supplying the processing gas from the diffusion space into a processing space on the substrate to be processed in the processing chamber,

the method, comprising;

a processing gas supplying process for supplying the processing gas to the processing space,

wherein the processing gas supplying process includes a process where a Peclet number is 0.5 and 2.5 when the processing gas passes through the processing gas supply holes.

17. The method of claim 16, wherein the metal organic compound is W(CO)₆.

18. The method of claim 16, the processing gas contains a carrier gas composed of an inert gas.

19. A computer readable storage medium storing therein a program for controlling the film forming method of claim 16.

20. A processing apparatus for processing a substrate by using a processing gas, comprising:

a gas supply mechanism having a plurality of gas supply holes, wherein the gas supply holes are shaped to have a Peclet number of 0.5 to 2.5 when the processing gas passes therethrough.