Alignment systems and methods for lithographic systems

• US 20060086910A1
• Filed: 12/06/2005
• Published: 04/27/2006
• Est. Priority Date: 09/20/2002
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Burghoorn, Jacobus, Jeunink, Andre Bernardus, Van Horssen, Hermanus Gerardus, Dunbar, Allan Reuben, Schets, Sicco Ian, Megens, Henry, Huijbregtse, Jeroen, Hinnen, Paul Christiaan, Franciscus Van Haren, Richard Johannes, Gertrudus Simons, Hubertus Johannes, Schuurhuis, Johny Rutger, Bok Lee, Brian Young, Y. Koren, Ramon Navarro, Maria Van Bilsen, Franciscus Bernardus, Theodoor Tolsma, Hoite Pieter
• Granted Patent: US 7,880,880 B2
• Time in Patent Office: Days
• US Class Current: 250/548
• CPC Class Codes: G03F 9/7046 Strategy, e.g. mark, sensor or wavelength selection
• CPC Class Codes: G03F 9/7049 Technique, e.g. interferometric
• CPC Class Codes: G03F 9/7076 Mark details, e.g. phase grating mark, temporary mark
• CPC Class Codes: G03F 9/7084 Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
• CPC Class Codes: G03F 9/7088 Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
• CPC Class Codes: G03F 9/7092 Signal processing

Abstract

An alignment system for a lithographic apparatus has a source of alignment radiation; a detection system that has a first detector channel and a second detector channel; and a position determining unit in communication with the detection system. The position determining unit is constructed to process information from said first and second detector channels in a combination to determine a position of an alignment mark on a work piece, the combination taking into account a manufacturing process of the work piece. A lithographic apparatus has the above mentioned alignment system. Methods of alignment and manufacturing devices with a lithographic apparatus use the above alignment system and lithographic apparatus, respectively.

Claims

1. An alignment mark for use in the manufacture of a micro-device, comprising:

a first target having a first detection pattern; and

a second target having a second detection pattern, wherein said first target is adapted to be detected by a first detector, and said second target is adapted to be detected by a second detector.

2. An alignment mark according to claim 1, wherein said first target is a first diffraction-order-enhancing grating having a first periodic grating pattern, and said second target is a second diffraction-order-enhancing grating having a second periodic grating pattern, said first target enhancing a diffracted beam of a different order from a diffracted beam enhanced by said second target.

3. An alignment mark according to claim 2, further comprising a third target having a third detection pattern, wherein said third target is a third diffraction-order-enhancing grating having a third periodic grating pattern, said third target enhancing a diffracted beam of a different order from said diffracted beams enhanced by said first and second targets.

4. An alignment mark according to claim 3, further comprising a fourth target having a fourth detection pattern, wherein said fourth target is a diffraction grating having a periodic pattern of a different period from said first, second and third periodic grating patterns.

5. A diffraction-order-enhancing alignment mark formed on an object for use in the manufacture of a micro-device that enhances a strength of a diffracted beam of non-zero order.

6. An alignment mark formed on an object for use in manufacture of a microdevice, comprising a target having a detection pattern and a processing pattern, wherein said processing pattern has a structure that changes under microdevice processing in correspondence with changes to said microdevice during manufacture.