Package structure for optical-electrical semiconductor

• US 20060086945A1
• Filed: 10/27/2004
• Published: 04/27/2006
• Est. Priority Date: 10/27/2004
• Status: Abandoned Application

• Current Assignee: Harvatek Corporation
• Original Assignee: Harvatek Corporation
• Inventors: Wang, Bily, Chuang, Jonnie, Wu, Shih-Yu, Weng, Chun-Cheng, Ko, Ching-Hung
• Application Number:
  US10/973,408
• Publication Number:
  US 20060086945A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A package structure for an optical-electrical semiconductor is described. The package structure has a thermal conductive structure for heat transfer and is integrally formed in one piece to improve the structural strength thereof, while the thermal conductive structure prevent over-heating of the LED device for greater longevity. The package structure reduces the failure rate in production and has improved quality. When the present invention is applied in light-emitting diode packages, the special requirement can be reached and has better properties than the prior art.

Claims

1. A package structure of an optical-electrical semiconductor, comprising:

a shell body having a heat conductive body and lead, wherein the shell body is integrally formed in one piece;

a piece of heat-conductive laminate;

an optical-electrical semiconductor structure being attached on a plane of the internal side of the shell body with the heat conductive laminate; and

a lens device formed of transparent material.

2. The package structure of an optical-electrical semiconductor as claimed in claim 1, wherein the heat conductive body is directly connected to the lead by an electrical insulation connection or the heat conductive body is indirectly connected to the lead with an electrical insulation sleeve, wherein the optical-electrical semiconductor structure has the ability to emit light or detect light, and wherein the lens device is installed on the heat conductive body in a position facing the optical-electrical semiconductor structure.

3. The package structure of an optical-electrical semiconductor as claimed in claim 1, further comprising a substrate fixed on a surface inside the heat conductive body, wherein the optical-electrical semiconductor structure has transparent polymer and electrical connection points, and the electrical connection points connect to a substrate in the heat conductive body.

4. The package structure of an optical-electrical semiconductor as claimed in claim 1, wherein the optical-electrical semiconductor structure contains a light-emitting diode or photo sensor.

5. The package structure of an optical-electrical semiconductor as claimed in claim 1, wherein the heat conductive body is made of a polymer, and has heat conductive material to form a connection route to transfer heat from the optical-electrical semiconductor structure to a bottom of the shell body.

6. The package structure of an optical-electrical semiconductor as claimed in claim 1, wherein the heat conductive body is made of a ceramic material, and has heat conductive material to form a connection route to transfer heat from the optical-electrical semiconductor structure to a bottom of the shell body.

7. The package structure of an optical-electrical semiconductor as claimed in claim 1, wherein the shell body is formed of metal.

8. The package structure of an optical-electrical semiconductor as claimed in claim 1, wherein optical-electrical semiconductor structure has bonding wire connected to the lead.

9. The package structure of an optical-electrical semiconductor as claimed in claim 1, wherein the heat-conductive laminate is a silicon-containing material or metal material.

10. The package structure of an optical-electrical semiconductor as claimed in claim 1, wherein the shell body is formed by metal injection modeling, and the electrical insulation sleeve envelopes the lead to insulate electrically the lead from the heat conductive body.

11. The package structure of an optical-electrical semiconductor as claimed in claim 3, wherein the substrate is made of a polymer, and capacitors or resistors are embedded in the substrate.

12. The package structure of an optical-electrical semiconductor as claimed in claim 1, wherein an arrangement method of the optical-electrical semiconductor structure is by average distributing in a special plane inside heat conductive body.