Transient thermoelectric cooling of optoelectronic devices

• US 20060088271A1
• Filed: 05/06/2005
• Published: 04/27/2006
• Est. Priority Date: 10/22/2004
• Status: Abandoned Application

• Current Assignee: Nanocoolers, Inc.
• Original Assignee: Nanocoolers, Inc.
• Inventors: Ghoshal, Uttam
• Application Number:
  US11/123,970
• Publication Number:
  US 20060088271A1
• Time in Patent Office: Days
• US Class Current: 385/147
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: F25B 2321/021 Control thereof
• CPC Class Codes: F25B 2321/025 Removal of heat
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/024 Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052
• CPC Class Codes: H01L 33/645 the elements being electrically controlled, e.g. Peltier elements
• CPC Class Codes: H01S 5/02234 Resin-filled housings; the housings being made of resin
• CPC Class Codes: H01S 5/02469 Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

A thermoelectric cooler may be transiently operated in substantial synchronization with operation of an optoelectronic device to provide extremely high density and intensity spot cooling when and where desired. The invented techniques described and illustrated herein can permit high luminous flux and/or longer lifetimes for a class of emissive device configurations and/or uses that generate intense highly localized, but transient heat flux. For example, certain Light Emitting Diode (LED) applications, e.g., white LEDs for flash illumination, certain solid state laser configurations and other similar configurations and uses may benefit from the developed techniques. In addition, the invented techniques described and illustrated herein can be employed in sensor configurations to provide greater device sensitivity. For example, in photosensitive device applications, e.g., CCD/CMOS imagers, the invented techniques may be employed to provide greater photon sensitivity and lower dark currents.

Claims

1. An apparatus comprising:

an optoelectronic device; and

a thermoelectric cooler thermally coupled to the optoelectronic device and operatively coupled to substantially synchronize a transient cooling operation of the thermoelectric cooler with an operation of the optoelectronic device.

2. The apparatus of claim 1, further comprising:

a synchronization circuit coupled to provide the substantial synchronization.

3. The apparatus of claim 1,

wherein the optoelectronic device and the thermoelectric cooler are electrically coupled in series such that a current flow therethrough powers and substantially synchronizes the transient cooling operation of the thermoelectric cooler with the optoelectronic device operation.

4. The apparatus of claim 1,

wherein the optoelectronic device and the thermoelectric cooler are electrically coupled in parallel such that related voltages applied thereto power and substantially synchronize the transient cooling operation of the thermoelectric cooler with the optoelectronic device operation.

5. The apparatus of claim 1, further comprising:

an array of optoelectronic devices including the optoelectronic device, the thermoelectric cooler thermally coupled to the array.

6. The apparatus of claim 1,

wherein the thermoelectric cooler is transiently operable to cool the optoelectronic device below an ambient temperature.

7. The apparatus of claim 1,

wherein the thermoelectric cooler is transiently operable to pre-chill the optoelectronic device and pre-transition a body of phase change material coupled thereto in anticipation of the synchronized with operation.

8. The apparatus of claim 1,

wherein the thermoelectric cooler is transiently operable to transfer thereacross heat evolved by the synchronized with operation of the optoelectronic device.

9. The apparatus of claim 1,

wherein the substantially synchronized transient cooling operation delivers cooling power to the optoelectronic device at least during the operation thereof.

10. The apparatus of claim 1,

wherein the substantially synchronized transient cooling operation delivers cooling power to the optoelectronic device prior to the operation thereof.

11. The apparatus of claim 1,

wherein the optoelectronic device includes a sensor device and wherein the synchronized with operation includes sampling a response of the sensor device to a photon flux.

12. The apparatus of claim 11, wherein the sensor device includes one or more of:

a charge coupled device (CCD); and

a complementary metal oxide semiconductor (CMOS) sensor.

13. The apparatus of claim 1,

wherein the optoelectronic device includes an emissive device.

14. The apparatus of claim 13,

wherein the synchronized with operation includes emission.

15. The apparatus of claim 13, wherein the synchronized with operation includes one or both of:

dissipation of a current through the emissive device; and

excitation of the emissive device.

16. The apparatus of claim 13, wherein the emissive device includes one or more of:

a light emitting diode (LED); and

a semiconductor laser.

17. The apparatus of claim 1, further comprising:

a body of phase change material that at least partially defines a heat transfer path from the optoelectronic device to the thermoelectric cooler.

18. The apparatus of claim 17,

wherein, as a result of the transient cooling operation of the thermoelectric cooler, at least a portion of the phase change material undergoes a transition from a first phase thereof to a second phase thereof.

19. The apparatus of claim 18,

wherein, as a result of an emissive operation of the optoelectronic device, at least a portion of the phase change material undergoes a transition from the second phase thereof to the first phase thereof.

20. The apparatus of claim 19,

wherein the phase change material undergoing the second-to-first phase transition absorbs a substantial portion of heat evolved by the emissive operation of the optoelectronic device.

21. The apparatus of claim 19,

wherein the transient cooling operation at least partially precedes the emissive operation.

22. The apparatus of claim 19,

wherein the transient cooling operation at least partially follows the emissive operation.

23. The apparatus of claim 1, further comprising:

a body of phase change material, wherein the thermoelectric cooler at least partially defines a heat transfer path from the optoelectronic device to the phase change material.

24. The apparatus of claim 23,

wherein, during transient operation of the thermoelectric cooler, temperature of a phase change material facing side of the thermoelectric cooler is substantially clamped based on a latent heat of transformation for the phase change material.

25. The apparatus of claim 23,

wherein, during transient operation of the thermoelectric cooler, at least a portion of the phase change material undergoes a transition from a first phase thereof to a second phase thereof.

26. The apparatus of claim 25,

wherein the phase change material undergoing the transition absorbs a substantial portion of heat transferred across the thermoelectric cooler during the transient operation thereof.

27. The apparatus of claim 25,

wherein the phase change material undergoing the transition absorbs a substantial portion of heat evolved by the synchronized with operation of the optoelectronic device.

28. A method comprising:

transiently cooling an optoelectronic device using a thermoelectric cooler thermally coupled thereto; and

substantially synchronizing the transient cooling with an operation of the optoelectronic device.

29. The method of claim 28, further comprising:

performing the transient cooling at least during the synchronized with operation of the optoelectronic device.

30. The method of claim 28, further comprising:

performing the transient cooling at least partially prior to an emissive or sampling operation of the optoelectronic device.

31. The method of claim 28,

wherein the optoelectronic device includes a sensor device;

and

wherein the substantially synchronized operation includes sampling a response of the sensor device to photon flux.

32. The method of claim 28,

wherein the transient cooling reduces temperature of the optoelectronic device below an ambient temperature

33. The method of claim 28,

wherein the optoelectronic device includes an emissive device;

and

wherein the substantially synchronized operation of the emissive device evolves heat.

34. The method of claim 33, further comprising:

transferring a substantial portion of the evolved heat across the thermoelectric cooler during the transient cooling.

35. The method of claim 28, further comprising:

substantially clamping temperature of one side of the thermoelectric cooler based on a latent heat of transformation of phase change material thermally coupled thereto.

36. The method of claim 28, further comprising:

absorbing into a transformation of phase change material, a substantial portion of heat transferred across the thermoelectric cooler during the transient operation thereof.

37. The method of claim 28, further comprising:

absorbing into a transformation of phase change material, a substantial portion of heat evolved by the substantially synchronized operation of the optoelectronic device.

38. The method of claim 28, further comprising:

pre-transforming, prior to the synchronized with operation, a body of phase change material.

39. An apparatus comprising,

an optoelectronic device;

a thermoelectric cooler thermally coupled to the optoelectronic device; and

a synchronization circuit coupled to substantially synchronize a transient cooling operation of the thermoelectric cooler with an operation of the apparatus.

40. The apparatus of claim 39,

wherein the synchronized with operation includes an emissive operation of the optoelectronic device.

41. The apparatus of claim 39,

wherein the synchronized with operation includes a sampling operation of the optoelectronic device.

42. The apparatus of claim 39,

wherein the transient cooling operation at least partially precedes an emissive or sampling operation of the optoelectronic device;

and

wherein the synchronized with operation triggers a ready to sample or emit state of the optoelectronic device.

43. The method comprising:

transiently cooling an optoelectronic device using a thermoelectric cooler; and

wherein the transient cooling is performed at least partially prior to, and in anticipation of, an operation of the optoelectronic device.

44. The method of claim 43, further comprising:

in connection with the transient cooling, pre-transitioning phase change material thermally coupled to the optoelectronic device from a first phase thereof to a second phase thereof.

45. The method of claim 43, further comprising:

substantially synchronizing the transiently cooling with an operation that triggers a ready to sample or emit state of the optoelectronic device.

46. A method of making an imaging product, the method comprising:

thermally coupling a thermoelectric cooler to an optoelectronic device; and

coupling a synchronization circuit to at least one of the optoelectronic device and the thermoelectric cooler to substantially synchronize a transient cooling operation of the thermoelectric cooler with an operation of the optoelectronic device.

47. The method of claim 46, further comprising:

coupling the synchronization circuit to the other of the optoelectronic device and the thermoelectric cooler.

48. The method of claim 46, wherein the optoelectronic device includes one of:

a charge coupled device (CCD);

a complementary metal oxide semiconductor (CMOS) array;

a light emitting diode; and

a semiconductor laser.

49. The method of claim 46,

wherein a body of phase change material is thermally coupled to the thermoelectric cooler such that, after the thermoelectric cooler is thermally coupled to the optoelectronic device, the thermoelectric cooler at least partially defines, during operation thereof, a heat transfer path from the optoelectronic device to the phase change material.

50. The method of claim 46, further comprising:

thermally coupling a body of phase change material to the thermoelectric cooler such that, during operation of the thermoelectric cooler, temperature of a hot-side thereof is substantially clamped at a phase change temperature of the phase change material.

51. The method of claim 46, further comprising:

packaging the imaging product as a digital camera.