Method of singulating electronic devices
First Claim
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1. A method of singulating electronic devices, comprising:
- aligning a saw blade over a lid street disposed on a lid substrate, said lid substrate disposed over a device substrate having an electronic device disposed on said device substrate, said electronic device having a bond pad, wherein said lid street is disposed over said bond pad; and
sawing partially through said lid street to form a trench in said lid street, said trench having a trench bottom in said lid substrate.
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Abstract
A method of singulating electronic devices, including aligning a saw blade over a lid street disposed on a lid substrate that is disposed over a device substrate. An electronic device that includes a bond pad is disposed on the device substrate, wherein the lid street is disposed over the bond pad. In addition, the method also includes sawing partially through the lid street to form a trench in the lid street. The trench includes a trench bottom in the lid substrate.
31 Citations
36 Claims
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1. A method of singulating electronic devices, comprising:
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aligning a saw blade over a lid street disposed on a lid substrate, said lid substrate disposed over a device substrate having an electronic device disposed on said device substrate, said electronic device having a bond pad, wherein said lid street is disposed over said bond pad; and
sawing partially through said lid street to form a trench in said lid street, said trench having a trench bottom in said lid substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
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33. A method of singulating electronic devices, comprising:
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step for aligning a saw blade over a lid street disposed over a device substrate having an electronic device disposed on said device substrate, said electronic device having a bond pad, wherein said saw blade is disposed over said bond pad; and
step for sawing partially through said lid street to form a trench in said lid street, said trench having a trench bottom in said lid substrate. - View Dependent Claims (34)
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35. A method, comprising:
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aligning a lid wafer to a device wafer, said lid wafer having a plurality of lids disposed thereon and a plurality of lid street regions disposed between said plurality of lids, said device wafer having a plurality of devices disposed thereon, each device having a plurality of bond pads disposed around a periphery of said device, wherein said plurality of lid street regions are disposed over said plurality of bond pads;
bonding said lid wafer to said device wafer;
aligning at least one saw blade over one of said plurality of lid street regions; and
sawing partially through said lid wafer to form a trench in said lid street region, said trench having a trench bottom.
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36. A method of singulating electronic devices, comprising:
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bonding a lid substrate to a device substrate, said lid substrate having at least one lid street disposed thereon, said device substrate having two or more electronic devices disposed thereon, each device having a bond pad, wherein said at least one lid street is disposed over said bond pad;
sawing partially through said lid street forming a trench in said lid street, said trench having a trench bottom in said lid substrate.
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Specification