Wafer packaging and singulation method
First Claim
Patent Images
1. A method comprising:
- providing a micro device wafer having micro devices supported by a wafer substrate and a multi-device lid substrate coupled to and spaced from the wafer substrate; and
sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate.
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Abstract
A method includes providing a micro device wafer having micro devices supported by a wafer substrate and a multi-device lid substrate coupled to and spaced from the wafer substrate. The method further includes sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate.
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Citations
31 Claims
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1. A method comprising:
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providing a micro device wafer having micro devices supported by a wafer substrate and a multi-device lid substrate coupled to and spaced from the wafer substrate; and
sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method comprising:
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providing a micro device wafer having micro devices supported by a wafer substrate, each micro device having a main portion and a contact point projecting from the main portion;
coupling a multi-lid substrate to a wafer substrate such that the lid substrate is supported and spaced above the contact point of each device; and
sawing through the lid substrate to a depth between the wafer substrate and the lid substrate so as to expose the contact point of each micro device. - View Dependent Claims (28)
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29. An apparatus comprising:
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a micro device wafer;
a multi-device lid; and
a bond ring moving between the wafer and the lid, wherein the bond ring has height of at least 10 micrometers. - View Dependent Claims (30)
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31. An apparatus comprising:
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a micro device wafer;
a multi-device lid; and
spacing the lid from the wafer by a distance greater than the maximum position variance of the saw during sawing of the lid without sawing the wafer.
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Specification