System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology

• US 20060088982A1
• Filed: 12/16/2004
• Published: 04/27/2006
• Est. Priority Date: 06/24/2003
• Status: Active Grant

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Redeker, Fred C., Boyd, John M.
• Granted Patent: US 7,675,000 B2
• Time in Patent Office: Days
• US Class Current: 438/460
• CPC Class Codes: B08B 3/04 Cleaning involving contact with liquid
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/1224 in vacuum
• CPC Class Codes: B23K 26/146 the fluid stream containing a liquid
• CPC Class Codes: B23K 26/40 taking account of the properties of the material involved
• CPC Class Codes: H01L 21/02052 Wet cleaning only H01L21/02085 takes precedence
• CPC Class Codes: H01L 21/02057 Cleaning during device manufacture
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67034 for drying
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304

Abstract

A substrate processing system includes a first, movable surface tension gradient device, a dicing device and a system controller. The first, movable surface tension gradient device is capable of supporting a first process within a first meniscus. The first meniscus being supported between the first surface tension gradient device and a first surface of the substrate. The first movable surface tension gradient device capable of being moved relative to the first surface of the substrate. The dicing device is oriented to a desired dicing location. The desired dicing location being encompassed by the meniscus. The system controller is coupled to the dicing device and the surface tension gradient device. The system controller includes a process recipe. A method for dicing a substrate is also described.

Claims

1. A substrate processing system comprising:

a first, movable surface tension gradient device capable of supporting a first process within a first meniscus, the first meniscus being supported between the first surface tension gradient device and a first surface of the substrate, the first movable surface tension gradient device capable of being moved relative to the first surface of the substrate;

a dicing device oriented to a desired dicing location, the desired dicing location being encompassed by the meniscus; and

a system controller being coupled to the dicing device and the surface tension gradient device, the system controller including a process recipe.

2. The system of claim 1, wherein the process includes at least one of a group of processes consisting of a cleaning process, a rinsing process, an etch process, a deposition process, and an electroplating process.

3. The system of claim 1, wherein supporting the process includes flowing a process fluid through the meniscus.

4. The system of claim 1, wherein supporting the process includes moving the meniscus relative to the first surface of the substrate.

5. The system of claim 1, wherein moving the meniscus relative to the first surface of the substrate includes drying the first surface.

6. The system of claim 1, wherein the dicing device includes a laser.

7. The system of claim 6, wherein the laser includes a water-jet laser.

8. The system of claim 1, wherein the surface tension gradient device includes a proximity head.

9. The system of claim 1, wherein the meniscus includes a dry region substantially surrounding the desired dicing location.

10. The system of claim 1, wherein the dicing device can be moved with the surface tension gradient device.

11. The system of claim 1, wherein the dicing device can be moved independent from the surface tension gradient device.

12. The system of claim 1, further comprising a sensor capable of monitoring the desired dicing location.

13. The system of claim 1, further comprising a dicing target supported on a second surface of the substrate, the second surface being opposite the first surface, the dicing target being supported in a position corresponding to the desired dicing location.

14. The system of claim 13, wherein the dicing device is a laser and the dicing target is a laser absorbing target.

15. The system of claim 1, further comprising a second, movable surface tension gradient device capable of supporting a second process within a second meniscus, the second meniscus being supported between the second surface tension gradient device and a second surface of the substrate, the second surface being opposite the first surface, the second movable surface tension gradient device capable of being moved relative to the second surface of the substrate.

16. Method of dicing a substrate comprising:

placing a substrate in a substrate dicing system;

forming a meniscus between a proximity head and a first surface of the substrate;

dicing the substrate at a desired dicing location and simultaneously capturing any particles and contaminants generated by dicing the substrate within the meniscus, the meniscus including the desired dicing location; and

moving the meniscus in a desired dicing direction.

17. The method of claim 16, wherein moving the meniscus in the desired dicing direction includes drying the first surface of the substrate.

18. The method of claim 16, wherein dicing the substrate includes a partial dicing.

19. The method of claim 16, wherein dicing the substrate includes applying a laser to the desired dicing location.

20. The method of claim 19, wherein applying the laser includes applying the laser through the meniscus.

21. The method of claim 19, wherein the meniscus is an annular meniscus and includes a dry central region and wherein applying the laser includes applying the laser through dry central region of the meniscus.

22. The method of claim 16, wherein dicing the substrate includes a full dicing.

23. The method of claim 22, further comprising forming a second meniscus between a second surface of the substrate, the second surface being opposite from the first surface of the substrate.

24. The method of claim 23, wherein dicing the substrate at the desired dicing location includes simultaneously capturing any particles and contaminants generated by dicing the substrate within the second meniscus.

25. The method of claim 23, wherein moving the first meniscus in the desired dicing direction includes moving the second meniscus.

26. The method of claim 22, wherein dicing the substrate includes:

applying a laser to the desired dicing location; and

absorbing the laser in a laser absorbing target near the second surface of the substrate.

27. A substrate processing system comprising:

a first proximity head capable of supporting a first process within a first meniscus, the first meniscus being supported between the first proximity head and a first surface of the substrate, the first proximity head capable of being moved relative to the first surface of the substrate;

a dicing laser source oriented to direct a laser to a desired dicing location, the desired dicing location being encompassed by the first meniscus;

a second proximity head capable of supporting a second process within a second meniscus, the second meniscus being supported between the second proximity head and a second surface of the substrate, the second surface being opposite the first surface, the second proximity head capable of being moved relative to the second surface of the substrate;

a laser absorbing target capable of being supported in a position corresponding to the desired dicing location; and

a system controller being coupled to the dicing laser source and the first and second proximity heads, the system controller including a process recipe.