Substrate processing system for performing exposure process in gas atmosphere

• US 20060090853A1
• Filed: 12/05/2005
• Published: 05/04/2006
• Est. Priority Date: 08/28/2001
• Status: Abandoned Application

• Current Assignee: Masaki Ikeda, Shusaku Kido, Yoshihide Iio
• Original Assignee: Masaki Ikeda, Shusaku Kido, Yoshihide Iio
• Inventors: Ikeda, Masaki, Kido, Shusaku, Iio, Yoshihide
• Application Number:
  US11/293,987
• Publication Number:
  US 20060090853A1
• Time in Patent Office: Days
• US Class Current: 156/345.33
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32449 Gas control, e.g. control of the gas flow
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence
• CPC Class Codes: H01L 21/6715 Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence
• CPC Class Codes: H01L 21/67248 Temperature monitoring
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins
• CPC Class Codes: H01L 21/68764 characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy

Abstract

A substrate processing system which sprays exposure process gas onto a substrate disposed within a chamber. The substrate processing system is used, for example, for performing an exposure process of an organic film formed on a substrate in a gas atmosphere obtained by vaporizing an organic solvent solution for dissolving and reflowing an organic film. The substrate processing system comprises: the chamber having at least one gas inlet and at least one gas outlets; a gas introducing means which introduces the exposure process gas into the chamber via the gas inlet; and a gas distributing means. The gas distributing means separates an inner space of the chamber into a first space into which the exposure process gas is introduced via the gas inlet and a second space in which the substrate is disposed. The gas distributing means has a plurality of openings via which the first space and the second space communicate with each other and introduces the exposure process gas introduced into the first space into the second space via the openings.

Claims

1-18. -18. (canceled)

19. A substrate processing system which sprays exposure process gas onto each of a plurality of substrates horizontally disposed and vertically spaced away from one another in a chamber,

the chamber having at least one gas inlet and at least one gas outlet, said system comprising:

a gas introducing means which introduces the exposure process gas into the chamber via the gas inlet; and

a plurality of gas distributing means each associated with each of the plurality of substrates,

each of the gas introducing means having a plurality of openings, wherein the exposure process gas having been introduced via the gas introducing means is sprayed onto an associated substrate via the opening.

20. The substrate processing system as set forth in claim 19, wherein each of the plurality of gas distributing means is disposed facing an associated substrate.

21. The substrate processing system as set forth in claim 19, wherein the chamber has a plurality of the gas inlets.

22. The substrate processing system as set forth in claim 21, wherein each of the gas inlets is associated with each of the plurality of gas distributing means.

23. The substrate processing system as set forth in claim 22, further comprising a gas flow rate controller for each of the gas inlets.

24. The substrate processing system as set forth in claim 19, wherein each of the plurality of gas distributing means is in the form of a plate.

25. The substrate processing system as set forth in claim 24, wherein each of the plurality of gas distributing mean comprises a curved plate convex or concave toward an associated substrate.

26. The substrate processing system as set forth in claim 19, wherein each of the plurality of gas distributing means is rotatable around the center thereof.

27. The substrate processing system as set forth in claim 19, further comprising a plurality of gas spouting range defining means each of which is disposed so as to overlap each of the gas distributing means and closes a predetermined number of openings among the opening formed in each of the gas distributing means, thereby defining a gas spouting range of the exposure process gas.

28. The substrate processing system as set forth in claim 19, further comprising a stage on which the substrates are placed, the stage being movable up and down.

29. The substrate processing system as set forth in claim 19, further comprising a stage on which the substrates are placed, the stage being rotatable around the center axis thereof.

30. The substrate processing system as set forth in claim 19, further comprising a substrate temperature control means which controls the temperature of each of the substrates.

31. The substrate processing system as set forth in claim 19, further comprising a stage on which the substrates are placed, the substrate temperature control means controlling the temperature of each of the substrates by controlling the temperature of the stage.

32. The substrate processing system as set forth in claim 19, further comprising a gas temperature control means which controls the temperature of the exposure process gas.

33. The substrate processing system as set forth in claim 19, wherein a distance between each of the substrates and each of the gas distributing means in the chamber is in the range of 5 mm and 15 mm both inclusive.

34. The substrate processing system as set forth in claim 19, further comprising a plasma generating means which generates plasma within the chamber.

35. The substrate processing system as set forth in claim 34, wherein the plasma generating means comprises an upper electrode disposed above each of the substrates and a lower electrode disposed below each of the substrates,

wherein one of the upper and lower electrodes is grounded, and the other is grounded via a high frequency power source.

36. The substrate processing system as set forth in claim 19, further comprising:

a reduced pressure transport chamber which is communicated with the chamber and which is used for transporting each of the substrates into the chamber under a reduced pressure condition and for transporting each of the substrates out from the chamber under a reduced pressure condition; and

a pressure controlled transport chamber which is communicated with the reduced pressure transport chamber, which is used for introducing each of the substrates from outside under the atmospheric pressure condition and for transporting each of the substrates into the reduced pressure transport chamber under a reduced pressure condition and which is used for transporting each of the substrates out from the reduced pressure transport chamber under a reduced pressure condition and for transporting each of the substrates outside under the atmospheric pressure condition.