Printing plate and method for fabricating the same

• US 20060091106A1
• Filed: 11/02/2005
• Published: 05/04/2006
• Est. Priority Date: 11/04/2004
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Philips LCD Company Limited (LG Display Co., Ltd.)
• Inventors: Kim, Chul Ho
• Granted Patent: US 7,914,691 B2
• Time in Patent Office: Days
• US Class Current: 216/41
• CPC Class Codes: B41C 1/02 Engraving; Heads therefor recording on record carriers, heads therefor G11B
• CPC Class Codes: B41N 1/006 made entirely of inorganic materials other than natural stone or metals, e.g. ceramics, carbide materials, ferroelectric materials
• CPC Class Codes: B41N 1/12 non-metallic other than stone , e.g. printing plates or foils comprising inorganic materials in an organic matrix B41N1/003, B41N1/006 take precedence
• CPC Class Codes: H10K 71/13 using printing techniques, e.g. ink-jet printing or screen printing
• CPC Class Codes: H10K 71/611 using printing deposition, e.g. ink jet printing
• CPC Class Codes: Y10T 428/2457 Parallel ribs and/or grooves

Abstract

A printing plate and method for fabricating the same is disclosed. A metal layer is first formed on a glass substrate. The metal layer is then patterned in a predetermined shape. The glass substrate is next etched to a predetermined depth using the patterned metal layer as a mask and the metal layer removed. If necessary, additional metal layers have the same or different patterns may be formed on the glass substrate and the glass substrate etched after each metal layer is formed thereon until a desired etching depth in the glass is achieved.

Claims

1. A printing plate comprising:

a glass substrate; and

a plurality of grooves in the glass substrate forming a surface with a predetermined shape, a portion of the surface in which the grooves are not formed having dimensions sufficient to accept a printing material capable of being used in fabrication of at least one of a semiconductor device or an LCD device.

2. The printing plate of claim 1, wherein the plurality of grooves have a uniform depth.

3. The printing plate of claim 1, wherein the plurality of grooves have non-uniform depths.

4. The printing plate of claim 3, wherein at least one of the grooves having a wider width than that of at least one of the other grooves has deeper depth than that of the at least one of the other grooves.

5. The printing plate of claim 1, wherein at least a first of the grooves has a different width than at least a second of the grooves.

6. A method for fabricating a printing plate, the method comprising:

forming a metal layer on a glass substrate;

patterning the metal layer in a predetermined shape; and

etching the glass substrate to a predetermined depth using the patterned metal layer as a mask.

7. The method of claim 6, further comprising repeating forming a metal layer, patterning the metal layer, and etching the glass substrate at least once.

8. The method of claim 7, wherein the predetermined shape of the metal is the same in every patterning of the metal layer.

9. The method of claim 7, wherein the predetermined shape of the metal is different in at least one patterning of the metal layer.

10. The method of claim 7, wherein the number of repetitions depends on a thickness of the metal layer and an etching depth of the glass substrate.

11. The method of claim 6, wherein etching the glass substrate comprises dry-etching the glass substrate.

12. The method of claim 6, wherein patterning the metal layer in the predetermined shape comprises:

coating a photoresist on the metal layer;

patterning the photoresist in the predetermined shape;

etching the metal layer using the patterned photoresist as a mask; and

removing the patterned photoresist.

13. The method of claim 6, wherein a non-etched portion of a surface in which grooves are formed has dimensions sufficient to accept a printing material capable of being used in fabrication of at least one of a semiconductor device or an LCD device.

14. A method of fabricating at least one of a semiconductor device or an LCD device comprising the method of claim 13, printing a predetermined material on an etched surface of the printing plate by rolling the first printing roll along the surface of the printing plate, transferring the predetermined material in a desired pattern on the etched surface of the printing plate to a second printing roll by rolling the second printing roll along the surface of the printing plate, and printing the predetermined material in the desired pattern on a surface of another substrate by rolling the second printing roll on the other substrate.

15. The method of claim 6, wherein, during etching of the glass substrate, the glass substrate is devoid of an organic material that has been deliberately disposed on the glass substrate.

16. A method for fabricating a printing plate comprising:

forming a first metal layer on a substrate having first portions and second portions;

patterning the first metal layer such that the first metal layer remains on the second portions of the substrate;

etching the substrate to a predetermined depth using the patterned first metal layer as a mask.

removing the first metal layer from the substrate;

forming a second metal layer on the substrate;

patterning the second metal layer on the substrate in a predetermined shape;

etching the substrate to the predetermined depth using the patterned second metal layer as a mask

17. The method of claim 16, wherein the second metal layer is patterned to remain on the second portions of the substrate.

18. The method of claim 16, wherein the second metal layer is patterned to remain on the second portions and at least one of the first portions of the substrate.

19. The method of claim 16, wherein the at least one of the first portions has a different width from that of other first portions.

20. The method of claim 16, wherein a non-etched portion of a surface in which grooves are formed has dimensions sufficient to accept a printing material capable of being used in fabrication of at least one of a semiconductor device or an LCD device.

21. A method of fabricating at least one of a semiconductor device or an LCD device comprising:

the method of claim 20, printing a predetermined material on an etched surface of the printing plate by rolling a first printing roll along the surface of the printing plate, transferring the predetermined material in a desired pattern on the etched surface of the printing plate to a second printing roll by rolling the second printing roll along the surface of the printing plate, and printing the predetermined material in the desired pattern on a surface of another substrate by rolling the second printing roll on the other substrate.

22. The method of claim 16, wherein, during etching of the glass substrate, the glass substrate is devoid of an organic material that has been deliberately disposed on the glass substrate.

23. A method of fabricating at least one of a semiconductor device or an LCD device, the method comprising:

printing a predetermined material on a surface of a printing plate by rolling a first printing roll along the surface of the printing plate, the printing plate containing a first substrate with a plurality of grooves etched in a predetermined shape on the surface;

transferring the predetermined material in a desired pattern on the surface of the printing plate to a second printing roll by rolling the second printing roll along the surface of the printing plate; and

printing the predetermined material in the desired pattern on a surface of a second substrate by rolling the second printing roll on the second substrate.

24. The method of claim 23, wherein the substrate comprises a glass substrate.

25. The method of claim 23, wherein the first printing roll is entirely coated with the predetermined material prior to rolling the first printing roll along the surface of the printing plate.

26. The method of claim 23, wherein the second substrate is an LCD substrate.

27. The method of claim 23, wherein the second substrate is a semiconductor substrate.

28. The method of claim 23, wherein the first and second substrates are formed from substantially the same material.