Probe card interposer

• US 20060091510A1
• Filed: 03/11/2005
• Published: 05/04/2006
• Est. Priority Date: 03/11/2004
• Status: Abandoned Application

• Current Assignee: ChipMOS TECHNOLOGIES (Bermuda) LTD. (Chipmos), Chipmos Technologies Incorporated (Chipmos)
• Original Assignee: ChipMOS TECHNOLOGIES (Bermuda) LTD. (Chipmos), Chipmos Technologies Incorporated (Chipmos)
• Inventors: Liu, An-Hong, Lee, Yao-Jung, Wang, Yeong-Her
• Application Number:
  US11/076,935
• Publication Number:
  US 20060091510A1
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: G01R 1/0416 Connectors, terminals G01R1/0425 and G01R1/0433 take precedence; with measurement function for battery poles G01R31/364
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: H05K 2201/0397 Tab forming integral conductive tabs H05K3/4092
• CPC Class Codes: H05K 2201/09909 Special local insulating pattern, e.g. as dam around component
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 3/326 the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/4092 Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Abstract

A probe card interposer includes a substrate with a plurality of conductive bumps disposed on first surface of the substrate. Each conductive bump comprises a dielectric core and a plurality of conductive leads. The suspended ends of the conductive wires extend toward the centers of the corresponding dielectric cores and are elastically supported by the corresponding dielectric cores. Therefore, the interposer can be installed between a probe head and a multi-layer PCB to make good electrical contacts to the probe head through the conductive bumps. In the embodiment, a plurality of symmetric conductive bumps are disposed on second surface of the substrate and are electrically connected to the conductive bumps on first surface of the substrate through vias or conductive posts. The conductive bumps can electrically contact the multi-layer PCB.

Claims

1. A probe card interposer for being installed between a multi-layer PCB and a probe head, comprising:

a substrate having a first surface and a second surface; and

a plurality of first conductive bumps disposed on the first surface, each first conductive bump including a first dielectric core and a plurality of first contact wires, each first contact wire having a first fixed end and a first suspended end, wherein the first fixed ends are bonded to the first surface adjacent to the corresponding first dielectric cores, and the first suspended ends extend toward the centers of the corresponding first dielectric cores such that the first contact wires can be elastically supported by the corresponding first dielectric cores.

2. The probe card interposer of claim 1, wherein the gap between the first suspended ends and the corresponding first dielectric core ranges from 0.05 μ

m to 0.5 μ

m.

3. The probe card interposer of claim 1, further comprising a plurality of second conductive bumps disposed on the second surface of the substrate to be aligned with the first conductive bumps.

4. The probe card interposer of claim 3, wherein each second conductive bump includes a second dielectric core and a plurality of second contact wires, wherein each second contact wire has a second fixed end and a second suspended end, wherein the second fixed ends are bonded to the second surface of the substrate and the second suspended ends extend toward the centers of the corresponding second dielectric cores such that the second contact wires are elastically supported by the corresponding second dielectric cores.

5. The probe card interposer of claim 4, wherein the substrate has a plurality of vias for electrical connections between the first contact wires and the second contact wires.

6. The probe card interposer of claim 1, wherein the first contact wires are MEMS probes.

7. The interposer of claim 1, wherein the first dielectric core is selected from a group of silicone gel and rubber.

8. The probe card interposer of claim 1, wherein the thickness of the first dielectric core ranges from 60 μ

m to 180 μ

m.

9. The probe card interposer of claim 1, wherein the first conductive bumps are arranged in a grid array.

10. The probe card interposer of claim 1, wherein the first contact wires are formed by wire bonding.

11. A probe card interposer comprising:

a substrate having a first surface and a second surface, the substrate including a plurality of first bonding pads on the first surface, a plurality of second bonding pads on the second surface, and a plurality of conductive posts electrically connecting the first bonding pads and the second bonding pads; and

a plurality of first conductive bumps disposed on the first bonding pads of the substrate, each first conductive bump including a plurality of first contact wires formed by wire bonding, wherein each first contact wire has a suspended end extending toward the centers of the corresponding first bonding pads.

12. The probe card interposer of claim 11, wherein the height between the suspended ends of the first contact wires and the corresponding first bonding pads ranges from 60 μ

m to 180 μ

m.

13. The probe card interposer of claim 11, wherein the dimension of the contact pads is larger than the corresponding diameter of the conductive posts to cover the conductive posts.

14. The probe card interposer of claim 11, further comprising a plurality of second conductive bumps disposed on the second bonding pads of the substrate and vertically aligned with the first conductive bumps.

15. The probe card interposer of claim 14, wherein each second conductive bump includes a plurality of second contact wires formed by wire bonding, each has a suspended end extending toward to the centers of the corresponding second bonding pads.

16. A probe card interposer comprising:

a substrate having a first surface and a second surface, the substrate including a plurality of first bonding pads on the first surface, a plurality of second bonding pads on the second surface, wherein the first bonding pads are electrically connected to and aligned with the corresponding second bonding pads; and

a plurality of first conductive bumps disposed on the first bonding pads of the substrate, each first conductive bump including a plurality of first contact wires formed by wire bonding, wherein each first contact wire has two first fixed ends bonded to the first bonding pads and a first suspended portion extending across the centers of the corresponding first bonding pads.

17. The probe card interposer of claim 16, further comprising a plurality of second conductive bumps disposed on the second bonding pads of the substrate.

18. The probe card interposer of claim 17, wherein each second conductive bump includes a plurality of second contact wires formed by wire bonding, wherein each second contact wire has two second fixed ends bonded to the second bonding pads and a second suspended portion extending across the centers of the corresponding second bonding pads.