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Plastic package and semiconductor component comprising such a plastic package, and method for its production

  • US 20060091522A1
  • Filed: 10/11/2005
  • Published: 05/04/2006
  • Est. Priority Date: 10/11/2004
  • Status: Active Grant
First Claim
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1. A plastic package comprising:

  • a semiconductor component with plastic outer faces, which comprises;

    a lower side having lower outer contact faces; and

    an upper side having upper outer contact faces, wherein the lower and upper outer contact faces are electrically connected together via conductor tracks, and wherein the conductor tracks comprise a metal layer which is arranged on conduction paths, the conduction paths comprising exposed conducting deposits in the plastic of the package.

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