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Flexible wiring board for tape carrier package having improved flame resistance

  • US 20060091548A1
  • Filed: 10/26/2005
  • Published: 05/04/2006
  • Est. Priority Date: 10/29/2004
  • Status: Active Grant
First Claim
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1. A flexible wiring board for tape carrier package having improved flame resistance, comprising an insulating film having a bending slit, a wiring pattern formed on the insulating film and crossing the bending slit, an adhesive layer adhering the wiring pattern to the insulating film, a flex resin layer protecting at least one side of the wiring pattern at the bending slit, and an overcoat layer protecting a region where the wiring pattern is formed;

  • wherein the overcoat layer is a layer of cured material of a curable resin composition having such a property that, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25°

    C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260°

    C., and an oxygen index exceeding 22.0.

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