Flexible wiring board for tape carrier package having improved flame resistance
First Claim
1. A flexible wiring board for tape carrier package having improved flame resistance, comprising an insulating film having a bending slit, a wiring pattern formed on the insulating film and crossing the bending slit, an adhesive layer adhering the wiring pattern to the insulating film, a flex resin layer protecting at least one side of the wiring pattern at the bending slit, and an overcoat layer protecting a region where the wiring pattern is formed;
- wherein the overcoat layer is a layer of cured material of a curable resin composition having such a property that, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25°
C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260°
C., and an oxygen index exceeding 22.0.
2 Assignments
0 Petitions
Accused Products
Abstract
A flexible wiring board for tape carrier package having improved flame resistance is disclosed. The flexible wiring board has an insulating film having a bending slit, a wiring pattern formed thereon and crossing the bending slit, an adhesive layer adhering the wiring pattern to the insulating film, a flex resin layer protecting the wiring pattern at the bending slit, and an overcoat layer protecting the wiring pattern, in which the overcoat layer is obtained from a curable resin composition, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25° C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260° C., and an oxygen index exceeding 22.0.
16 Citations
10 Claims
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1. A flexible wiring board for tape carrier package having improved flame resistance, comprising
an insulating film having a bending slit, a wiring pattern formed on the insulating film and crossing the bending slit, an adhesive layer adhering the wiring pattern to the insulating film, a flex resin layer protecting at least one side of the wiring pattern at the bending slit, and an overcoat layer protecting a region where the wiring pattern is formed; wherein the overcoat layer is a layer of cured material of a curable resin composition having such a property that, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25°
C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260°
C., and an oxygen index exceeding 22.0.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
Specification