LED light source

• US 20060091772A1
• Filed: 11/01/2004
• Published: 05/04/2006
• Est. Priority Date: 11/01/2004
• Status: Active Grant

• Current Assignee: Taiwan Gigantic Light Electric Corporation Ltd.
• Original Assignee: Chia Mao Li
• Inventors: Li, Chia Mao
• Granted Patent: US 7,282,841 B2
• Time in Patent Office: Days
• US Class Current: 313/46
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/77 with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 33/0076 Safety or security signalisation, e.g. smoke or burglar alarms, earthquake detectors; Self-defence devices
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

An LED light source applied to surveillance cameras as an infrared source or a visible-light source has a light emitting diode (LED) as the light emitting mechanism. The LED chip is mounted on a surface of a metallic body of high thermal conductivity, the surface being planar for scattering light or convex for collimating light. The heat produced in the LED chip is quickly guided to a heat-sink structure much massive than the chip and having large contact area with a heat radiating structure, thereby effectively dissipating the heat and increasing the power capacity of the chip. The heat-sink structure has a plurality of elongated heat conducting members confined by an insulating bracket at one end and mounted on a metallic base on the other end. The metallic base can be coupled with a heat radiator to enhance heat radiation.

Claims

1. A LED light source, comprising:

a heat sink body including a bundle of elongated heat conducting members having a first end face for mounting an infrared light emitting chip and a second end face for connecting a front face of a heat-conduction base, said first and second end faces being selected from one of planar surfaces and convex surfaces, said heat conducting members being confined by an insulating bracket locating close to said first end face, whereby said heat sink body can absorb the heat produced in said infrared light emitting chip and quickly transfer the heat to said heat-conduction base;

a heat-conduction base having a first end and a second end each provided with a screw thread of different calibers, said screw thread at said first end for engaging a screw thread formed on an inner wall of an infrared light base, said screw thread at said second end for engaging a screw thread formed on an inner wall of a lampshade, said heat-conduction base being capable of absorbing and dissipating the heat conducted from said heat sink body;

an electrically insulating bracket for retaining and confining said heat conducting members of said heat sink body, said insulating bracket having an inner face attached on a front face of said heat-conduction base; and

an electrically insulating heat-conducting layer disposed between said inner face of said insulating bracket and said front face of said heat-conduction base.

2. The LED light source of claim 1 wherein said heat sink body is made of a metallic material of high thermal conductivity selected from gold, silver, copper and aluminum.

3. The LED light source of claim 1 wherein the geometry of said heat sink body is selected from a cylinder, a cube and an irregular polygon.

4. The LED light source of claim 1 wherein said heat conducting members of said heat sink body are retained by an insulating bracket and attached to said heat-conduction base, and wherein the number of said heat conducting members is determined by the power of said light emitting diode, said insulting bracket therefore changing the diameter and the structure thereof accordingly.

5. The LED light source of claim 1 wherein said heat-conduction base is made of a metallic material of high thermal conductivity selected from gold, silver, copper and aluminum, and wherein said heat-conduction base is a part of the outer shell of said LED light source or is connected to an heat radiator that is selected to be a part of the outer shell of said LED light source.

6. The LED light source of claim 1 wherein said outer screw thread at said first end of said heat-conduction base can be connected to a unit selected from said infrared light base by engaging said inner screw thread thereof and a heat radiator of predetermined geometric structure.

7. The LED light source of claim 6 wherein said heat radiator is made of a metallic material and provided with heat releasing holes on an outer surface thereon.

8. The LED light source of claim 1 wherein said heat-conduction base further includes a slot for passing wires that supply power to said LED light source.

9. The LED light source of claim 1 wherein said lampshade is made of a metallic material of high thermal conductivity selected from gold, silver, copper and aluminum.

10. The LED light source of claim 1 wherein said lampshade is secured with said heat-conduction base and assist heat dissipation, and wherein an inner wall of said lampshade forms a bowl-shaped surface and is provided with a protective lens over the front opening thereof.

11. The LED light source of claim 1, wherein the infrared light emitting chip includes light emitting diodes.